Synthesis and characterization of phenylethynyl-terminated polyimide oligomers derived from 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride and 3,4′-oxydianiline

Yu, Ping; Wang, Yan; Yu, Junrong; Zhu, Jing; Hu, Zuming

doi:10.1007/s10118-016-1733-4

Cited by 23 publications

(17 citation statements)

References 35 publications

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“…Solubility of the oligomers OD‐BMI‐1, OD‐BMI‐2, BP‐BMI‐1, and BP‐BMI‐2 in various solvents with 10 wt% of solid content at ambient temperature was summarized in Table . These results indicate that introducing the asymmetric groups and ether groups to the oligomer chains indeed significantly improve the solubility in a range of solvents including 1,4‐dioxane and chloroform with low boiling point . Figure showed the solubility of OD‐BMI‐1 oligomer with 50 wt% in DMAc solvent.…”

Section: Resultsmentioning

confidence: 77%

Synthesis and characterization of asymmetric bismaleimide oligomers with improved processability and thermal/mechanical properties

Yang

Pan

et al. 2019

Polymer Engineering & Sci

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Novel asymmetric bismaleimide (BMI) oligomers with different molecular weights and dianhydrides were designed and synthesized by 3,4′‐oxydianiline (3,4′‐ODA), 2,3,3′,4′‐oxydiphthalic dianhydride (a‐ODPA), and 2,3,3′,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA). The chemical structures of BMI oligomers were confirmed by Fourier transform infrared spectrometry (FTIR) and gel permeation chromatography (GPC). X‐ray diffraction (XRD) exhibited broad peaks, suggesting amorphous structures. Heat flow curves of oligomers measured by differential scanning calorimeter (DSC) displayed wide processing window due to low glass transition temperatures (Tg). BMI oligomers exhibited high solubility in common organic solvents. Particularly, the OD‐BMI‐1 oligomer exhibited excellent solubility of more than 50 wt% in DMAc solvent. Tg value and minimum complex viscosity of OD‐BMI‐1 oligomer were only 121 °C and 8.1 Pa · s, respectively. The cured BMI resins possess high thermal and thermal‐oxidative stability. The Tg and the temperature of 5% weight loss in nitrogen were above 256 and 449 °C, respectively, and the residual weight percentages at 800 °C were all >49%. Moreover, films made of BMI resins exhibited excellent mechanical properties flexibility, as confirmed by photograph and DMA results of films. The elongation at break of the prepared films was found to be high (almost >9.6%). POLYM. ENG. SCI., 59:2265–2272, 2019. © 2019 Society of Plastics Engineers

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Section: Resultsmentioning

confidence: 77%

Synthesis and characterization of asymmetric bismaleimide oligomers with improved processability and thermal/mechanical properties

Yang

Pan

et al. 2019

Polymer Engineering & Sci

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“…The imide oligomer PEI‐PEPA with the calculated polymerization degree of 6 was synthesized with a‐ODPA, 3,4′‐ODA, and PEPA in NMP according to our previous work . The general procedure for the synthesis of PEI‐PEPA is as follows.…”

Section: Methodsmentioning

confidence: 99%

“…On the other hand, the homogeneous solutions could be used to prepare the cured films of imide systems for DMA and mechanical properties test. The preparation of films was according to the procedures previously described …”

Section: Methodsmentioning

confidence: 99%

“…The fast growth of electronics and aerospace industries has lead to the developments of PETI oligomers with enhanced properties. In our recent works, a series of 4‐phenylethynylphthalic anhydride (PEPA)‐terminated imide oligomers prepared by the reaction of 2,3,3′,4′‐diphenyl ether tetracarboxylic acid dianhydride (a‐ODPA) and 3,4′‐oxydianiline (3,4′‐ODA) with different molecular weights (degree of polymerization: n = 1–9) were developed . Among them, oligomer with n = 6 (PEI‐PEPA: phenylethynyl‐terminated polyether imide oligomer) had good processability and excellent mechanical properties after cured.…”

Section: Introductionmentioning

confidence: 99%

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Development of novel cardo-containing phenylethynyl-terminated polyimide with high thermal properties

Wang

et al. 2016

Polym. Adv. Technol.

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A phenylethynyl‐terminated reactive diluent [Card‐4‐phenylethynylphthalic anhydride (PEPA)], which contained fluorenyl cardo structures, was successfully synthesized and used as a modifier for flexible phenylethynyl‐terminated imide oligomer (PEI‐PEPA). The chemical structure, crosslink characterization, molecular weights, and thermal properties of the products were characterized. The imide systems with addition of 10, 20, 30, and 40 wt% Card‐PEPA to PEI‐PEPA (PEI‐PEPA‐Card) and their cured resin systems were prepared. The thermal curing behaviors of imide systems at different heating rates were analyzed by using differential scanning calorimetry. Thermal properties such as glass transition temperature (Tg) and char yield at 800°C of the resultant resin systems were studied by differential scanning calorimetry, dynamic mechanical analysis, and thermogravimetric analysis. The rheological properties were also investigated using a dynamic rheometry. These properties were found to be outstanding compared with pure PEI‐PEPA. The uncured imide systems exhibited lower Tg and lower isothermal viscosity with addition of Card‐PEPA. Furthermore, the Tg and char yield of the cured resin systems increased with addition of Card‐PEPA. The cured resin systems containing 40 wt% Card‐PEPA exhibited the highest Tg of 359°C and char yield at 800°C of 66.5%. Copyright © 2016 John Wiley & Sons, Ltd.

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“…An alternative strategy is to make structural changes based on the understanding that the superior performance of polyimide materials is mainly attributed to the structures of polymer chains. Very tiny changes in the chemical structures of the reaction monomers may have critical effects on the overall properties of the resulting PI [11][12][13][14]. For instance, introducing flexible links, bulky substituents, fluorinated groups, and copolymerization can improve the processability of polyimides without sacrificing the excellent thermal stability [15][16][17][18][19][20][21][22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Synthesis and Characterization of Semicrystalline Polyimides Containing Bridged Linkages

Chen

2018

International Journal of Polymer Science

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A series of polyimides (PI) containing bridged linkages were prepared successfully through a three-step technique. The results indicated that the glass transition temperature (T g ) of polyimides was affected by flexibility of polymer chain and the intermolecular interactions. ODPA-TPER-based polyimide possesses the lowest T g , which was 214°C. All polyimides had semicrystalline characteristics, and ODPA-TPER-based PI exhibited the lowest melting temperature (T m ) at 316°C. The polyimides had high weight loss temperatures, which indicated that bridged linkages can reduce the softening temperature, meanwhile keeping excellent thermal stability.

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Synthesis and characterization of phenylethynyl-terminated polyimide oligomers derived from 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride and 3,4′-oxydianiline

Cited by 23 publications

References 35 publications

Synthesis and characterization of asymmetric bismaleimide oligomers with improved processability and thermal/mechanical properties

Synthesis and characterization of asymmetric bismaleimide oligomers with improved processability and thermal/mechanical properties

Development of novel cardo-containing phenylethynyl-terminated polyimide with high thermal properties

Synthesis and Characterization of Semicrystalline Polyimides Containing Bridged Linkages

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