System dynamics model of high-power LED luminaire

Huang, Bin‐Juine; Tang, Chun-Wen; Wu, Min-Sheng

doi:10.1016/j.applthermaleng.2008.03.038

Cited by 54 publications

(27 citation statements)

References 12 publications

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“…Some studies can be found in the literature concerning the cooling of LED lamps. This can include what happens inside [1,2] or outside the LED module using detailed CFD studies in a steady-state approach, such as in [3][4][5][6][7][8][9][10][11][12], some of them including the packing aspects leading to the LED module. More specifically, Luo et al [1] conducted a numerical and experimental study considering the whole set composed by the vapour chamber and a finned heat sink, and Arika et al…”

Section: Accepted Manuscriptmentioning

confidence: 99%

“…Huang et al [10] studied the thermal dynamics of the overall set of a LED fixture including the luminaire, the LED lamps and the heat sink, and Houl et al [13] studied the thermal dynamics of a LED array system wit in line pin fin heat sink. Ha [11] considered the numerical simulation of a high power LED package and extracted the values of the most relevant thermal resistances of the system.…”

Section: Accepted Manuscriptmentioning

confidence: 99%

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Improved radial heat sink for led lamp cooling

Costa

Lopes

2014

Applied Thermal Engineering

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This paper presents a numerical study concerning an improved heat sink for a light emitting diodes (LED) lamp operating under natural convection conditions. Basic geometry of the heat sink is of cylindrical nature, to be obtained from cutting a aluminium extruded bar comprising a cylindrical central core and a number of uniformly distributed radial fins. Minimum diameter of the central core is fixed and the parameters to be explored are the number of fins, their thickness, length (radial dimension) and height. Although not included in the numerical simulations, the thermal resistance due to the use of a thin thermal interface material (TIM) layer between the LED lamp back and the heat sink is taken into account in the analysis. The main objective of the heat sink is to cool the LED lamp so that the lamp maximum temperature at the contact region with the heat sink is maintained below the critical temperature given by the manufacturer. This is a crucial aspect in what concerns the expected lifetime of the LED lamp and should be achieved at the expenses of a as low as possible aluminium mass. Taking these criteria in mind, a design procedure is proposed and followed in the search for the improved heat sink to cool a particular LED lamp. Results obtained with the commercial code ANSYS-CFX clearly show the relative importance of the different governing parameters on the heat sink performance and allow the choice of the better solution within the frame of dimensional constrains. Although the present results concern a particular LED lamp, the proposed methodology can be extended to other types of heat sinks for general light and/or electronic components.

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Section: Accepted Manuscriptmentioning

confidence: 99%

Section: Accepted Manuscriptmentioning

confidence: 99%

Improved radial heat sink for led lamp cooling

Costa

Lopes

2014

Applied Thermal Engineering

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“…Huang et. al [11]. The system dynamics model of the LED was adopted to evaluate energy effect by utilizing step response method.…”

Section: Introductionmentioning

confidence: 99%

High Power LED Thermal and Stress Simulation on Copper Slug

Vairavan

Sauli

Retnasamy

et al. 2013

2013 UKSim 15th International Conference on Computer Modelling and Simulation

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High power LED are captivating attention due to its cogent impacts on lighting industry in terms of efficacy, low power consumption, long lifetime and miniature physical size. Nonetheless, the efficiency and reliability of the LED is signified by the junction temperature. This work demonstrates the thermal and stress simulation of single chip LED package with 1mm x1mm x 1mm copper heat slug. The simulation was performed using Ansys version 11. The GaN LED chip was powered with input power of 0.1 W and 1 W. The simulation outcome exhibited that at the maximum junction temperature and stress of the LED chip were 115.81°C and 221.56MPa correspondingly for input power of 1W.

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“…However, most of these heat sinks were not optimized in cooling efficiency, dimension, and material cost. Lots of researchers have already studied the cooling of LED lamps [3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20], which are mainly operated under natural or forced convection. More specifically, a numerical and experimental research considering the whole set constituted by the vapour chamber and a finned heat sink was conducted in [3].…”

Section: Introductionmentioning

confidence: 99%

“…In [20], numerical simulation was conducted to investigate the impingement and film composite cooling on blade leading region. The luminance of LED lamp is greatly related to junction temperature, so evaluating the junction temperature is one of the methods to determine its heat dissipation [6][7][8][9][10]. In [6], the junction temperature was assessed by the heat dissipation simulation of a single chip high power LED package, and an electric-heat-optical system dynamics model for LED luminance control was provided in [7].…”

Section: Introductionmentioning

confidence: 99%

Modelling and Numerical Simulations of Heat Distribution for LED Heat Sink

Zhu

Sun

2016

Discrete Dynamics in Nature and Society

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Light-emitting diode (LED) has higher efficiency and longer lifetime when compared with the conventional lighting. However, the efficiency and lifetime will be degraded greatly when it is operated at a high temperature. Now, both previous simulation and experimental results have already indicated that the heat transfer in vertical direction of the LED lamp by conduction is the most critical component. In this paper, a simplified numerical simulation model is built to estimate the heat distribution of the LED heat sink in the spherical coordinate system, which would be useful for its shape optimization design. With this model, some mathematical treatments are provided to a heat conduction equation, in order to rapidly compute the static heat distribution and the temperature of different designs of LED heat sinks. The built rapid heat sink evaluation method, implicit finite difference method (IFDM), is unconditionally stable. Several heat distribution simulations could demonstrate that our built mathematical model conforms well to the reality and our method is full of feasibility and effectiveness.

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System dynamics model of high-power LED luminaire

Cited by 54 publications

References 12 publications

Improved radial heat sink for led lamp cooling

Improved radial heat sink for led lamp cooling

High Power LED Thermal and Stress Simulation on Copper Slug

Modelling and Numerical Simulations of Heat Distribution for LED Heat Sink

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