IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. 2005
DOI: 10.1109/iedm.2005.1609432
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Systematic study of work function engineering and scavenging effect using NiSi alloy FUSI metal gates with advanced gate stacks

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Cited by 22 publications
(22 citation statements)
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“…However, a somewhat larger NMOS NiSi Φ m of 4.28 ± 0.01 eV was obtained on HfO 2 , which could be due to the influence of the underlying dielectric on gate Φ m [12]. Still, this value is comparable to other modulated NMOS NiSi Φ m on Hf-based dielectrics using different modulation techniques such as Al implantation (∼4.27 eV) [3] or Ni-Al alloying (∼4.25-4.30 eV) [6]. No significant difference in fixed charge densities (≤∼ 3 × 10 11 cm −2 ) was observed from the V FB versus T ox plots.…”
Section: Resultsmentioning
confidence: 59%
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“…However, a somewhat larger NMOS NiSi Φ m of 4.28 ± 0.01 eV was obtained on HfO 2 , which could be due to the influence of the underlying dielectric on gate Φ m [12]. Still, this value is comparable to other modulated NMOS NiSi Φ m on Hf-based dielectrics using different modulation techniques such as Al implantation (∼4.27 eV) [3] or Ni-Al alloying (∼4.25-4.30 eV) [6]. No significant difference in fixed charge densities (≤∼ 3 × 10 11 cm −2 ) was observed from the V FB versus T ox plots.…”
Section: Resultsmentioning
confidence: 59%
“…However, the effectiveness of this method is limited by the difficulty in obtaining Si bandedge Φ m and the inability to achieve significant Φ m modulation on Hf-based high-k dielectrics. Alternatively, NiSi and Ni-rich silicides have been investigated for dual gate integration in a conventional CMOS flow [4]- [6]. Yet, the small Φ m difference of ∼0.…”
Section: Introductionmentioning
confidence: 98%
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“…[266][267][268][269][270], alloyed metals [271][272][273], conductive metal oxides (RuO 2 , IrO 2 , etc.) [274,275], nitride alloyed metals [276][277][278], and alloyed FUSI [279][280][281]. Conductive oxides such as RuO 2 and IrO 2 , can provide high work function values in addition to affording the use of standard etching and processing techniques.…”
Section: Fundamental Limitationsmentioning
confidence: 98%
“…For example, work functions of 4.1 eV and 4.9 eV have been obtained by Yb and Ga pre-dopants, respectively [297]. By alloying with different elements, both high and low work function can be obtained, such as Pt or Ge for pMOS and Al for nMOS, respectively [280,319]. Moreover, FUSI alloy can achieve additional scalibilities as compared to other FUSI gate.…”
Section: Fully Silicided (Fusi) Gatesmentioning
confidence: 99%