“…Magnetron sputtering is a physical vapor deposition process [ 1 , 2 ] widely used in various target-substrate configurations, typically categorized as planar and angular systems. In planar systems [ 3 , 4 ], the target surface is arranged parallel to the substrate surface, either horizontally or vertically, while angular systems [ 5 , 6 ] employ a tilted target surface-configured target substrate, oriented in a top-down [ 7 ] or bottom-up [ 8 , 9 ] vertical direction. In both laboratory and industrial applications, planar and angular systems often utilize multiple cooperative magnetron targets, each equipped with two or more magnetron guns, to produce multilayer thin films.…”