Control
of plasma and radical generation and associated energy
deposition near the growing thin films are still the main challenges
in materials fabrication in the plasma-assisted deposition of Si quantum
dot (QD) thin film. To control and enhance the material’s performance
concerning film properties and application durability, we prepare
2.6 nm sized Si QDs with a fully ordered structure and entrapped them
in amorphous silicon nitride using advanced dual frequency capacitively
coupled plasmas. Raman and XRD analyses consistent with the high-resolution
transmission electron micrographs reveal that the QD size can be controlled
and altered from ∼2.6 to 4.0 nm simply by changing the operating
pressure, which affects the film’s crystallinity in a broad
range from 60% to 72% and the resulting microstructure. Further, a
broad visible range ∼ 1.8–3.0 eV photoluminescence,
with intense intensity and narrow to broad widths, is observed from
Si QDs films. It is also seen that the observed photoluminescence
featured is due to the quantum confinement effect within the QD material.
Data reveal that the film properties are controllable by modifying
a change in the plasma properties and radical parameters. The radio
frequency and ultrahigh frequency dual frequency plasmas at low operating
pressures have produced a very high atomic density of H and N radicals
and a very high plasma density at low electron temperature, which
are critically necessary and favorable to the control of film growth,
nucleation, and other film properties. It is also seen that the deposition
energy plays a significant role for the resulting microstructure and
the QD size. The high luminescent yields in the visible range with
a PL lifetime of ∼0.75 ns and size-tunable low-temperature
deposition with plasma and radical control enable these QD materials
as a good candidate for light emitting applications. Additionally,
a plausible mechanism is foreseen for the QD film formation.