Technologies for Cofabricating MEMS and Electronics

Fedder, Gary K.; Howe, Roger T.; Liu, Tsu‐Jae King; Quévy, E.

doi:10.1109/jproc.2007.911064

Cited by 225 publications

(125 citation statements)

References 69 publications

Supporting

Mentioning

124

Contrasting

Unclassified

Order By: Relevance

“…One of the key factors contributed to the remarkable MEMS commercial success is the development of Si-based micromachining technology and CMOS MEMS [1], because integration of micromechanical parts and CMOS circuits has facilitated mass production of MEMS devices from various aspects, e.g., high production yield, low fabrication cost, available foundry service, etc. In particular, flat micromirror driven by MEMS actuators is the essential component for enabling most applications of optical MEMS.…”

Section: Introductionmentioning

confidence: 99%

A 1-V Operated MEMS Variable Optical Attenuator Using Piezoelectric PZT Thin-Film Actuators

Lee

Hsiao

Kobayashi

et al. 2009

IEEE J. Select. Topics Quantum Electron.

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

A 1-V Operated MEMS Variable Optical Attenuator Using Piezoelectric PZT Thin-Film Actuators

Lee

Hsiao

Kobayashi

et al. 2009

IEEE J. Select. Topics Quantum Electron.

View full text Add to dashboard Cite

“…Well-established top-down planar processing and surface-micromachining techniques should be leveraged for the high-volume manufacture of NEM relays. Ideally, a relay fabrication process should be compatible with back-end-of-line (BEOL) processing to facilitate co-integration with CMOS circuitry [69].…”

Section: Remaining Challenges and Pathways To Solutions For Nem Relaymentioning

confidence: 99%

Nanoelectromechanical Switches for Low-Power Digital Computing

Peschot¹,

Qian²,

Liu³

2015

Micromachines

View full text Add to dashboard Cite

Abstract:The need for more energy-efficient solid-state switches beyond complementary metal-oxide-semiconductor (CMOS) transistors has become a major concern as the power consumption of electronic integrated circuits (ICs) steadily increases with technology scaling. Nano-Electro-Mechanical (NEM) relays control current flow by nanometer-scale motion to make or break physical contact between electrodes, and offer advantages over transistors for low-power digital logic applications: virtually zero leakage current for negligible static power consumption; the ability to operate with very small voltage signals for low dynamic power consumption; and robustness against harsh environments such as extreme temperatures. Therefore, NEM logic switches (relays) have been investigated by several research groups during the past decade. Circuit simulations calibrated to experimental data indicate that scaled relay technology can overcome the energy-efficiency limit of CMOS technology. This paper reviews recent progress toward this goal, providing an overview of the different relay designs and experimental results achieved by various research groups, as well as of relay-based IC design principles. Remaining challenges for realizing the promise of nano-mechanical computing, and ongoing efforts to address these, are discussed.

show abstract

“…At device level, fundamental approaches involve manipulating flexural vibrations of mechanical structures (for example, tuning forks) and acoustic waves in crystals (for example, quartz), harnessing the sharply frequency-selecting functions offered by the high-quality (Q) resonances in these vibrations and waves [1][2][3][4][5][6][7] . Advances in surface micro/nanomachining technologies 8,9 have spurred unceasing miniaturization of vibrating mechanical devices, with rapid developments in resonant micro/nanoelectromechanical systems (MEMS/NEMS) and with the promise of monolithic integration on chip [10][11][12] . Intertwined with miniaturizing sizes, shape engineering and materials innovations in the underlying device structures further add great versatility to these advances.…”

mentioning

confidence: 99%

Spatial mapping of multimode Brownian motions in high-frequency silicon carbide microdisk resonators

2014

View full text Add to dashboard Cite

High-order and multiple modes in high-frequency micro/nanomechanical resonators are attractive for empowering signal processing and sensing with multi-modalities, yet many challenges remain in identifying and manipulating these modes, and in developing constitutive materials and structures that efficiently support high-order modes. Here we demonstrate high-frequency multimode silicon carbide microdisk resonators and spatial mapping of the intrinsic Brownian thermomechanical vibrations, up to the ninth flexural mode, with displacement sensitivities of B7 À 14 fm Hz À 1/2 . The microdisks are made in a 500-nm-carbide on 500-nm-oxide thin-film technology that facilitates ultrasensitive motion detection via scanning laser interferometry with high spectral and spatial resolutions. Mapping of these thermomechanical vibrations vividly visualizes the shapes and textures of high-order Brownian motions in the microdisks. Measurements on devices with varying dimensions provide deterministic information for precisely identifying the mode sequence and characteristics, and for examining mode degeneracy, spatial asymmetry and other effects, which can be exploited for encoding information with increasing complexity.

show abstract

Technologies for Cofabricating MEMS and Electronics

Cited by 225 publications

References 69 publications

A 1-V Operated MEMS Variable Optical Attenuator Using Piezoelectric PZT Thin-Film Actuators

A 1-V Operated MEMS Variable Optical Attenuator Using Piezoelectric PZT Thin-Film Actuators

Nanoelectromechanical Switches for Low-Power Digital Computing

Spatial mapping of multimode Brownian motions in high-frequency silicon carbide microdisk resonators

Contact Info

Product

Resources

About