Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

Wakamoto, Keisuke; Mochizuki, Yo; Otsuka, Takukazu; Nakahara, Ken; Namazu, Takahiro

doi:10.3390/ma13184061

Cited by 21 publications

(9 citation statements)

References 33 publications

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“…The fracture mechanism of void growth is considered to differ from that of edge cracking. The observed cracking modes in the present work also showed differences in comparison with other studies mentioned in Section 1 [30][31][32]. Vertical cracks in the die layer seemed to be dominant in the cross-section SEM observation results after accelerated TST in the liquid-liquid chamber.…”

Section: Cross-section Sem Images After Tstcontrasting

confidence: 84%

“…In this study, the bilinear elastic-plastic mechanical property of s-Ag was employed. The modeled bilinear line refers to s-Ag's temperature dependence in the stress-strain curve that was measured from a previous study's results [30]. Each input value is shown in Table 1.…”

Section: Strain Distribution By Finite Element Analysismentioning

confidence: 99%

“…Based on the results, s-Ag of a pressure above 30 MPa with around 5% p shows good mechanical properties. Furthermore, pressure-assisted s-Ag temperature dependence on mechanical properties has also been investigated corresponding with the TST temperature circumstance [29,30]. The s-Ag mechanical property changed from brittle to ductile at a temperature of around 100 • C. Furthermore, our team reported that higher temperatures in the TST (30 to 150 • C) led to faster deterioration of s-Ag than the low temperature range (−60 to 60 • C) by using a 60 MPa pressure-assisted s-Ag die attach SiC chip assembly.…”

Section: Introductionmentioning

confidence: 99%

“…The authors of [30][31][32] tried to perform a TST evaluation with a liquid-liquid chamber by using an AMB assembly bonded with three different p levels of s-Ag: p was set to 8%, 12%, and 20%. The temperature cycle pattern was set to −60 to 150 • C in each cycle.…”

Section: Introductionmentioning

confidence: 99%

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Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test

et al. 2021

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This paper investigates the degradation mechanism of pressure-sintered silver (s-Ag) film for silicon carbide (SiC) chip assembly with a 2-millimeter-thick copper substrate by means of thermal shock test (TST). Two different types of silver paste, nano-sized silver paste (NP) and nano-micron-sized paste (NMP), were used to sinter the silver film at 300 °C under a pressure of 60 MPa. The mean porosity (p) of the NP and MNP s-Ag films was 2.4% and 8%, respectively. The pore shape of the NP s-Ag was almost spherical, whereas the NMP s-Ag had an irregular shape resembling a peanut shell. After performing the TST at temperatures ranging from −40 to 150 °C, the scanning acoustic tomography (SAT) results suggested that delamination occurs from the edge of the assembly, and the delamination of the NMP s-Ag assembly was faster than that of the NM s-Ag assembly. The NMP s-Ag assembly showed a random delamination, indicating that the delamination speed varies from place to place. The difference in fracture mechanism is discussed based on cross-sectional scanning electron microscope (SEM) observation results after TST and plastic strain distribution results estimated by finite element analysis (FEA) considering pore configuration.

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Section: Cross-section Sem Images After Tstcontrasting

confidence: 84%

Section: Strain Distribution By Finite Element Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test

et al. 2021

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“…The buffer stack was involved into the model with the same material properties as the (RE)BCO layer because of very similar material properties and negligible impact on the final results of the FEA. In order to input nonlinear material properties of Hastelloy C276 [38], Ag [39][40][41][42], (RE)BCO + buffer [43] and Cu [38] in temperature range from −200 • C to 200 • C, elasto-plastic model with bilinear isotropic hardening was used.…”

Section: Mechanical Propertiesmentioning

confidence: 99%

Experimental and Numerical Analysis of High-Temperature Superconducting Tapes Modified by Composite Thermal Stabilization Subjected to Thermomechanical Loading

et al. 2021

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The strain behavior of SiC/Stycast 2850 FT composites under thermomechanical loading using a finite element analysis (FEA) was studied. These composites can serve as thermal stabilizers of high-temperature superconducting (HTS) tapes during limitation event in resistive superconducting fault current limiter (R-SCFCL) applications. For this purpose, the thermomechanical properties of four composite systems with different filler content were studied experimentally. The FEA was calculated using an ANSYS software and it delivered useful information about the strain distribution in the composite coating, as well as in particular layers of the modified HTS tapes. The tapes were subjected to bending over a 25 cm core, cooled in a liquid nitrogen (LN2) bath, and finally, quenched from this temperature to various temperatures up to 150 °C for a very short time, simulating real limitation conditions. The outputs from simulations were also correlated with the experiments. The most promising of all investigated systems was SB11-SiC20 composite in form of 100 µm thick coating, withstanding a temperature change from LN2 up to 120 °C.

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A Computational Multiscale Modeling Method for Nanosilver-Sintered Joints with Stochastically Distributed Voids

Sun,

Guo,

Jørgensen

2024

J. Electron. Mater.

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A high power density is required in wide band gap power semiconductor packaging, which has led to the popularity of sintered nanosilver as an interconnecting material. However, affected by stochastically distributed voids in its microstructure, this material in practice exhibits instability leading to reduced reliability. In this paper, a computational multiscale modeling method is proposed to simulate the influence of micro-voids on macro-properties, providing an efficient tool to analyze the aforementioned problem. At the micro-scale, the three-parameter Weibull distribution of the equivalent Young’s modulus and the normal distribution of the equivalent Poisson’s ratio are captured by Monte Carlo-based finite element simulation on the reconstructed stochastic representative elements, where the density and distribution morphology of micro-voids are taken into consideration. At the macro-scale, the effect of the microscopic voids is transferred through a random sampling process to construct the multiscale model. The effectiveness and validity of the proposed method are verified through experimental case studies involving the modeling of nanosilver-sintered joints sintered at temperatures of 275°C and 300°C. In addition, the effects of the sintering temperature on the dispersion of the micro-voids, the distribution fluctuation of the constitutive parameters, and the mechanical properties are also discussed based on numerical and experimental results. Graphical Abstract

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Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

Cited by 21 publications

References 33 publications

Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test

Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test

Experimental and Numerical Analysis of High-Temperature Superconducting Tapes Modified by Composite Thermal Stabilization Subjected to Thermomechanical Loading

A Computational Multiscale Modeling Method for Nanosilver-Sintered Joints with Stochastically Distributed Voids

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