Temporal characterisation of silicon sensors on Timepix3 ASICs

Dall’Occo, E.; Akiba, K. Carvalho; Beuzekom, M. van; Buchanan, E.; Collins, P.; Evans, T.; Lima, V. Franco; Geertsema, R. E.; Schindler, H.; Snoek, H.; Tsopelas, P.

doi:10.1088/1748-0221/16/07/p07035

Cited by 7 publications

(13 citation statements)

References 28 publications

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“…These effects can be observed in the intrapixel track positions (see appendix C). A minimum in the fraction of size 1 clusters is not observed due to the sensors not being fully depleted at 1000 V [6,7]. After irradiation, there was no significant increase in noise hits with the threshold set at the default 1000 e − value.…”

Section: Jinst 17 P06038mentioning

confidence: 92%

“…As described in section 2, the Micron n-on-n prototypes are thinner, and hence the best resolution occurs at a larger angle. After irradiation the active sensor volume is shallower, due to the change in the effective doping concentration [6]. This leads to a less pronounced dependency as a function of the incident angle, even at the highest operational bias voltage, as presented in figure 9 (b).…”

Section: Track Anglementioning

confidence: 94%

“…The depletion voltages were measured to be around ∼120 V for HPK devices and ∼40 V for both types of Micron devices [6,7]. A subset of devices were uniformly irradiated with neutrons at JSI [8], up to 8 × 10 15 1 MeV n eq cm −2 , referred to as full fluence.…”

Section: Prototype Devicesmentioning

confidence: 99%

“…Below full depletion (40 V), the field is weak in the vicinity of the implants and thus the charge diffuses further, which enhances charge sharing and hence the fraction of size 2 clusters. The weak field region is always narrow enough, about 20 μm [6], that the charge will diffuse towards the implants and thus be collected. As the applied bias voltage increases, the field strengthens, the diffusion and charge sharing is suppressed and -5 - hence the fraction of size 2 clusters monotonically decreases.…”

Section: Bias Voltagementioning

confidence: 99%

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Spatial resolution and efficiency of prototype sensors for the LHCb VELO Upgrade

Buchanan¹,

Akiba²,

Beuzekom³

et al. 2022

J. Inst.

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A comprehensive study of the spatial resolution and detection efficiency of sensor prototypes developed for the LHCb VELO upgrade is presented. Data samples were collected at the CERN SPS H8 beam line using a hadron mixture of protons and pions with momenta of approximately 180 GeV/c. The sensor performance was characterised using both irradiated and non-irradiated sensors. Irradiated samples were subjected to a maximum fluence of 8 × 1015 1 MeV neq cm-2, of both protons and neutrons. The spatial resolution is measured comparing the detected hits to the position as predicted by tracks reconstructed by the Timepix3 telescope. The resolution is presented for different applied bias voltages and track angles, sensor thickness and implant size.

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Section: Jinst 17 P06038mentioning

confidence: 92%

Section: Track Anglementioning

confidence: 94%

Section: Prototype Devicesmentioning

confidence: 99%

Section: Bias Voltagementioning

confidence: 99%

See 2 more Smart Citations

Spatial resolution and efficiency of prototype sensors for the LHCb VELO Upgrade

Buchanan¹,

Akiba²,

Beuzekom³

et al. 2022

J. Inst.

Self Cite

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“…The main motivation is to cope with the high occupancy at hadron colliders operating at a high number of collisions per bunch crossing, by separating tracks from different quasi-simultaneous collisions [1]. The Timepix Application Specific Integrated Circuit (ASIC) family has previously been employed in the reconstruction of charged particle trajectories [2,3,4,5], in particular as an R&D platform for sensors, ASICs and other detector components used for the upgrades of the LHCb experiment. Timepix4 [6] is a novel ASIC designed for performing both temporal and spatial measurements with 195 ps bin width and 55 × 55 µm 2 pixel size.…”

Section: Introductionmentioning

confidence: 99%

Reconstruction of charged tracks with Timepix4 ASICs

Akiba

Beuzekom

Beveren

et al. 2022

Preprint

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The design of a detector system comprised of four silicon sensors bumpbonded to Timepix4 ASICs is described together with its data acquisition system, operational infrastructure, and dedicated software. The spatial and temporal performance of the system are assessed with a 180 GeV/c mixed hadron beam at the CERN SPS and reported in detail. Particle tracks are reconstructed using time-space measurements from the four detector planes. The spatial hit resolution is assessed to be (15.5 ± 0.5) µm and (4.5 ± 0.3) µm for 100 µm and 300 µm thick sensors, respectively. The timestamps from the detectors are also measured with fine precision, yielding time resolutions of (452±10) ps, (420±10) ps, (639±10) ps, (631±10) ps for the two 100 µm and two 300 µm thick sensors respectively. These measurements are combined to a track time resolution of (340 ± 5) ps.

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Timing measurements with a 3D silicon sensor on Timepix3 in a 180 GeV/c hadron beam

Heijhoff¹,

Akiba²,

Bates³

et al. 2021

J. Inst.

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Test beam measurements have been carried out with a 3D sensor on a Timepix3 ASIC and the time measurements are presented. The measurements are compared to those of a thin planar sensor on Timepix3. It is shown that for a perpendicularly incident beam the time resolution of both detectors is dominated by the Timepix3 front-end. The 3D detector is dominated by the time-to-digital conversion whereas the analog front-end jitter also gives a significant contribution for the thin planar detector. The 3D detector reaches an overall time resolution of 567 ± 6 ps compared to 683 ± 8 ps for the thin planar detector. For a grazing angle beam, however, the thin planar detector achieves a better time resolution because it has a lower pixel capacitance, and therefore suffers less from jitter in the analog front-end for the low charge signals that mainly occur in this type of measurement. Finally, it is also shown that the 3D and thin planar detector can achieve time resolutions for large clusters of about 100 ps and 250 ps, respectively, by combining many single hit measurements.

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Temporal characterisation of silicon sensors on Timepix3 ASICs

Cited by 7 publications

References 28 publications

Spatial resolution and efficiency of prototype sensors for the LHCb VELO Upgrade

Spatial resolution and efficiency of prototype sensors for the LHCb VELO Upgrade

Reconstruction of charged tracks with Timepix4 ASICs

Timing measurements with a 3D silicon sensor on Timepix3 in a 180 GeV/c hadron beam

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