ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures
DOI: 10.1109/icmts.1993.292910
|View full text |Cite
|
Sign up to set email alerts
|

Test structure for the in-plane locations of project features with nanometer-level accuracy traceable to a coordinate measurement system

Abstract: Manufacturing future generations of semiconductor devices through the year ZOO0 will require the overlay of successive patterns of material on wafers with accuracy and precision of the order of tensof-nanometers. Feature placement metrology will need to operate at several times less than this, typically providing accuracy and precision at about the IO-nm level. Electrical test structures designed for determining feature placement have been shown to be capable of meeting precision requirements to the 2-nm preci… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...
2
1

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
references
References 5 publications
0
0
0
Order By: Relevance