2001
DOI: 10.1007/s003390100812
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Texturing effects in molybdenum and aluminum nitride films correlated to energetic bombardment during sputter deposition

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Cited by 19 publications
(3 citation statements)
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“…In figure 7, the compressive stress increases gradually with increasing F N 2 . Drüsedau et al [35] have demonstrated that in a nitride sputtering mode (nitride formed on the surface of the target) the total irradiation energy per deposited atom increases significantly with increasing N 2 flow rate during reactive sputtering deposition of AlN, which has also been observed in reactive sputtering deposition of TiN [37]. Correspondingly, the same phenomenon may take place in this work.…”
Section: Deposition Rate and Issupporting
confidence: 81%
See 1 more Smart Citation
“…In figure 7, the compressive stress increases gradually with increasing F N 2 . Drüsedau et al [35] have demonstrated that in a nitride sputtering mode (nitride formed on the surface of the target) the total irradiation energy per deposited atom increases significantly with increasing N 2 flow rate during reactive sputtering deposition of AlN, which has also been observed in reactive sputtering deposition of TiN [37]. Correspondingly, the same phenomenon may take place in this work.…”
Section: Deposition Rate and Issupporting
confidence: 81%
“…As F N 2 increases from 5 to 60 sccm, the deposition rate decreases gradually and reaches a minimum value of 0.14 nm s −1 at F N 2 = 60 sccm. A similar trend has been observed in reactive sputtering Nb [16], Ta [34] or Al [35] target in discharging a mixture of N 2 and Ar gas. which at a constant current, the target voltage increases with an increase in F N 2 .…”
Section: Deposition Rate and Microstructuresupporting
confidence: 80%
“…24 Mo is also used as a back contact for advanced solar cell assemblies. The method presented in the present paper is applied to molybdenum ͑Mo͒ films.…”
Section: Introductionmentioning
confidence: 99%