“…In parallel, the requirements for SOI wafer quality become more and more severe and many efforts have been made to realize high quality. Many teams went on with their work with co-implanting ions, such as O + , N + , F + and so on [4][5][6][7][8][9][10][11], to improve the property of the SOI wafer radhardness to harden the SOI devices. However, there have not been any research teams who have studied the relationship between dose of N + ions implanting into separation-byimplantion SIMOX wafer and the microstructure, while the status of the microstructure closely affects the properties, especially the radiation hardness of devices fabricated on the materials.…”