The Characterization of Via‐Filling Technology with Electroless Plating Method

Harada, Yusuke; Fushimi, Kimihisa; Madokoro, S.; Sawai, Hideo; Ushio, Shintaro

doi:10.1149/1.2108421

Cited by 18 publications

(12 citation statements)

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“…At high overpotential, the surface concentration of X becomes zero and a limiting current density il is obtained i~ = nFAD ~ [1] in which n is the number of transferred electrons, F the Faraday constant, A the surface area, Cb the bulk concentration, D the diffusion coefficient, and 8 the thickness of the diffusion layer. For a small spatially isolated circular electrode (microdisk electrode), one can show that, under steady-state conditions, the diffusion-limited current density due to nonlinear diffusion/~1 is equal to ~3 inl = 4nFAD (~r) [2] By comparing Eq. 1 and 2 it is clear that nonlinear diffusion can be neglected fully for large substrates.…”

Section: Mass Transport In the Liquid Phasementioning

confidence: 99%

Geometrical Effects in the Electroless Metallization of Fine Metal Patterns

Putten

Bakker

1993

J. Electrochem. Soc.

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Electroless plating is used commercially for the simple and low cost deposition of metal coatings on relatively large area substrates. For plating of very fine metal patterns such as (submicron) contact holes in integrated circuit technology, anomalous behavior has been found with respect to the initiation and film growth. First, the areas to be metallized are so small that mass transport by nonlinear diffusion, which is considerably enhanced compared to linear diffusion to large area substrates, must be considered. A second effect that must be considered is electrical connections within the substrate. An ohmic connection of a small hole to a large substrate leads to plating potential pinning of this hole, i.e., the local potential at the contact hole during plating is determined by the steady-state value that is established at the large area substrate. Dependent on the exact conditions, these two geometrical effects can lead to both an enhanced growth rate of the metal compared to bulk substrates, or to no metal deposition at all. The experimental observations can be explained by the mixed potential theory. This insight in turn indicates how uniform deposition rates in contact holes still can be achieved, regardless of their exact geometry.

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Section: Mass Transport In the Liquid Phasementioning

confidence: 99%

Geometrical Effects in the Electroless Metallization of Fine Metal Patterns

Putten

Bakker

1993

J. Electrochem. Soc.

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“…The electroless deposition of metals and alloys can be considered an established industrial practice. Apart from its well-known applications in circuit technology 1 and for the production of corrosion and wear-resistant coatings, 2,3 this technique has also attracted interest as a preparation method for new electrocatalytic electrode materials. 4,5 Electroless Ni±P alloy is a typical metal±metalloid binary system and has been extensively investigated.…”

Section: Introductionmentioning

confidence: 99%

Influence of phosphorus content on the structure of nickel electroless deposits

2001

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“…23,24 However, attempts to form micropatterns by electroless deposition using dimethylamineborane ͑DMAB͒ as the reducing agent showed that the film deposition occurred not only on the catalytic surface but also on the photoresist. [26][27][28] The behavior of the electroless deposition system is said to depend on the nature of the catalyst 29,30 and the substrate geometry. 31 In our previous study, the selectivity of electroless deposition from the DMAB bath was improved by using bath agitation and incorporating organic additives in the plating bath.…”

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confidence: 99%

Micropattern Formation for Magnetic Recording Head Using Electroless CoFeB Deposition

Yokoshima

Nakamura

Kaneko

et al. 2002

J. Electrochem. Soc.

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The method of electroless deposition of CoFeB thin films has been improved and used to fabricate the write head core for magnetic recording. The currently available method is poorly selective in depositing thin films on surfaces patterned with photoresist; i.e., the deposition occurs not only on the catalytic surface but also on the surface of the photoresist. To improve the selectivity, the effects of bath agitation and organic additives were investigated. Extraneous deposition on the photoresist was decreased by deposition with agitation in a paddle plating cell system and/or by adding thiodiglycolic acid in the bath without any effect on the coercivity of the resulting thin film. The new techniques enabled consistently uniform deposition of the film on the patterned surface of the write head core. The improved electroless deposition system operated under optimized conditions is suitable for future applications involving the deposition of the alloy in fine-patterned structures.

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The Characterization of Via‐Filling Technology with Electroless Plating Method

Abstract: not Available.

Cited by 18 publications

References 0 publications

Geometrical Effects in the Electroless Metallization of Fine Metal Patterns

Geometrical Effects in the Electroless Metallization of Fine Metal Patterns

Influence of phosphorus content on the structure of nickel electroless deposits

Micropattern Formation for Magnetic Recording Head Using Electroless CoFeB Deposition

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