1988
DOI: 10.1016/0040-6090(88)90261-1
|View full text |Cite
|
Sign up to set email alerts
|

The deposition and film properties of reactively sputtered titanium nitride

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
9
0

Year Published

1990
1990
2017
2017

Publication Types

Select...
4
2
1

Relationship

0
7

Authors

Journals

citations
Cited by 42 publications
(9 citation statements)
references
References 22 publications
0
9
0
Order By: Relevance
“…Thus a high concentration of gas molecules prevents sputtered particles of titanium, nitrogen and titanium nitride from settling to the surface of the sample. The growth rate of TiN on Si may reach maximum saturation at low N 2 concentration [4]. In this study, it was not observed.…”
Section: Resultsmentioning
confidence: 56%
See 3 more Smart Citations
“…Thus a high concentration of gas molecules prevents sputtered particles of titanium, nitrogen and titanium nitride from settling to the surface of the sample. The growth rate of TiN on Si may reach maximum saturation at low N 2 concentration [4]. In this study, it was not observed.…”
Section: Resultsmentioning
confidence: 56%
“…252 nm thick film has a resistivity 23.6 µOm cm that corresponds to the thicker TiN coatings [3]. First of all the resistivity depends on stoichiometry, which differ for various N 2 /Ar ratio value [4], and on film thickness [5]. Actually, resistivity of 100-120 nm thin film 4 times more than 250-300 nm TiN film.…”
Section: Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…Underlaying the Al with Ti caused an increase in lifetime. However, failure in dll cases was due to a short rather than an open circuit [10]. Figure 6 is a graph of the electrical resistivity (p) as a function of the film composition.…”
Section: Resultsmentioning
confidence: 98%