The effect of Ni addition on Cu-Sn intermetallic growth rate values in the SAC solder

Mayappan, Ramani; Ghani, Nurunajah Ab; Yahya, Iziana

doi:10.1063/1.5066972

Cited by 2 publications

(2 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Figure 2a,b show the TEM lamellar and an on-zone Cu 6 Sn 5 grain, respectively. The Cu 3 Sn layer thickened as a result of ageing at 150 • C for 500 h [2,3,23]. Kirkendall voids, which often accompany the formation of Cu 3 Sn [3], are present between the Cu 3 Sn and the OSP-Cu (Figure 2a).…”

Section: Resultsmentioning

confidence: 99%

“…The soldering process involves heating the solder alloy above its melting temperature to react with the Cu substrate to form an intimate bond. During this process, Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds (IMCs) form at the interface between the solder melt and the Cu substrates [2,3]. The reactions at the interfaces between liquid solder/Cu 6 Sn 5 /Cu 3 Sn/solid substrates are complex.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

et al. 2022

View full text Add to dashboard Cite

The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due to the lack of direct observation at micro- and nano-meter resolutions. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur in Cu6Sn5 between a Sn-3.0 wt%Ag-0.5 wt%Cu (SAC305) solder alloy and a Cu substrate in situ at temperatures above the solidus of the alloy. This enables the continuous surveillance of rapid grain boundary movements of Cu6Sn5 during soldering and increases the fundamental understanding of reaction mechanisms in solder solid/liquid interfaces.

show abstract