low temperature growth, single crystal compound semiconductor, back-end-of-line device, heterogeneous integration, 3D integration In this work, a low temperature templated liquid phase (LT-TLP) growth process is presented, that enables one to directly grow high optoelectronic quality single crystalline compound semiconductors (InP and InAs) on amorphous dielectrics at temperatures below 400 o C. Uniquely, the material quality is optimal when InP is grown at 300 o C, a temperature which is low enough to enable back-end-of-line growth on fully fabricated Si CMOS circuits. Using this low-temperature grown InP, a transistor fabrication process is then entirely carried out at 300 o C or below, and an indium phosphide nanoribbon field effect transistor with excellent on/off ratios is demonstrated, indicating low defect density in the material. Overall, this approach enables growth of large area (tens of micron) single crystal compound semiconductor at low temperatures, establishing a back-end-of-line (BEOL) compatible process for monolithic 3D device integration.