The effect of silicon substrate on thickness of SiO2 thin film analysed by spectral reflectometry and interferometry

Hlubina, Petr; Luňáček, Jiří; Ciprián, Dalibor

doi:10.1007/s00340-009-3418-y

Cited by 7 publications

(3 citation statements)

References 11 publications

(25 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The thickness and shape measurements of transparent objects are important in engineering. High-precision optical techniques, such as ellipsometry [1], reflectometry [2], white-light interferometry [3], etc. are widely used for the thickness and refractive index of transparent films due to the non-contact, full field and high-efficient characteristics.…”

Section: Introductionmentioning

confidence: 99%

Measurement of transparent profile using multispectral 3D digital image correlation

Tang

Chen

et al. 2023

International Conference on Optical and Photonic Engineering (icOPEN 2022)

View full text Add to dashboard Cite

Three-dimensional (3D) digital image correlation (DIC) based on fluorescent speckle pattern is becoming popular for measuring 3D profiles and deformations. However, the simultaneous monitoring of both the front and rear surfaces remains challenging due to the different refractive indexes of light in different media. In this study, we utilized a multispectral 3D DIC method using fluorescent speckle patterns and a 3CCD camera for the front and rear surfaces measurement of transparent objects. Fluorescent speckle patterns excited red or blue light were sprayed on the interested surfaces before measurement. Then, the red channel and blue channel sub-systems of a virtual 3D DIC system with a 3CCD camera were used to simultaneously capture both the front and back surfaces, respectively. To unify the sub coordinate systems of different channels, a calibration model of the 3CCD camera considering the sensor designed optical path difference (OPD) was proposed. Furthermore, profile reconstruction was corrected based on Snell's law to eliminate the refractive distortion caused by the different refractive indexes. The experimental results of transparent flat and curved objects showed that the accuracy of this method was significantly improved.

show abstract

Section: Introductionmentioning

confidence: 99%

Measurement of transparent profile using multispectral 3D digital image correlation

Tang

Chen

et al. 2023

International Conference on Optical and Photonic Engineering (icOPEN 2022)

View full text Add to dashboard Cite

show abstract

“…Thin film is a special two-dimensional surface structure on the substrate to improve working performance. It has been widely used in many fields such as semiconductor chips, solar cells, consumer electronics [1][2][3]. For example, in semiconductor chips, electronic isolation or migration is achieved by the gate oxide films, metal films, etc.…”

Section: Introductionmentioning

confidence: 99%

Thin-film thickness measurement with normal spectral reflectance

Bai,

Yang,

Chen

et al. 2023

Advanced Sensor Systems and Applications XIII

View full text Add to dashboard Cite

Thin films are used in many areas for protecting the base, isolating electrons, and so on. Based on the thin-film interference principle and the characteristics of Y-shaped fiber, this paper proposed a reflection objective with annular reflection. With the objective, incident light from the central fiber can be well received for high signal-to-noise ratio. By comparing with the prior-known spectral reflectance of the standard mirror, the absolute spectral reflectance of the thin-film can be achieved. Furthermore, according to the spectral reflectance of the thin-film, film thickness is acquired by the evolutionary genetic algorithm. In the algorithm, the thickness is taken as the independent variable, and the squared difference between the measured spectral reflectance and the preset theoretical spectral reflectance is set as the goal to carry out the global optimization. By testing different silicon-based silica films, the measurement results proved high feasibility and good global fitness. And the total measurement time of a single point is less than 1s. In conclusion, the thin-film measurement system based on the proposed reflection objective and inversion algorithm own excellent performance, which is hopeful for broad usage.

show abstract

“…Moreover, the spectral reflectance measurement was possible in the same set-up. These techniques have also been used for measuring small changes in the thickness of a SiO 2 thin film grown by thermal oxidation on different Si substrates [13].…”

Section: Introductionmentioning

confidence: 99%

Spectral interferometric technique to measure the relative phase change on reflection from a thin-film structure

2010

Self Cite

View full text Add to dashboard Cite

A two-step white-light spectral interferometric technique to measure the relative phase change on reflection from a thin-film structure is presented. The technique is based on recording of the channelled spectra at the output of a Michelson interferometer and their processing by using a windowed Fourier transform to retrieve the phase functions. In the first step, the phase difference between the beams of the interferometer with a thin-film structure is retrieved. In the second step, the structure is replaced by a reference sample of known phase change on reflection and the corresponding phase difference is retrieved. From the two phase differences, the relative phase change on reflection from the thinfilm structure is obtained. The feasibility of the simple method is confirmed in processing the experimental data for a SiO 2 thin film on a Si wafer of known optical constants. Four samples of the thin film are used and their thicknesses are determined. The thicknesses obtained are compared with those resulting from reflectometric measurements, and good agreement is confirmed.

show abstract

The effect of silicon substrate on thickness of SiO2 thin film analysed by spectral reflectometry and interferometry

Cited by 7 publications

References 11 publications

Measurement of transparent profile using multispectral 3D digital image correlation

Measurement of transparent profile using multispectral 3D digital image correlation

Thin-film thickness measurement with normal spectral reflectance

Spectral interferometric technique to measure the relative phase change on reflection from a thin-film structure

Contact Info

Product

Resources

About