1976
DOI: 10.1149/1.2132809
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The Effect of Substrate Bias on the Properties of Reactively Sputtered Silicon Nitride

Abstract: FLATBAND VOLTAGES OF MOS CAPACITORS 303hr and fields up to 6 • 106 V/cm. For a 15 min bias stress of 106 V/cm. no flatband voltage shifts could be detected except for the sample corresponding to 105 cma/min of TCE/He, in which a positive shift of 0.55V was observed. It would be consistent with the initial flatband measurements if this shift were due to the motion of mobile charge acquired in the sample oxidized with the high TCE/He flow rate. The ions H + or H30 + which are mobile at room temperature (7) are p… Show more

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Cited by 14 publications
(1 citation statement)
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“…Radio frequency (RF) bias sputtering of silica, which when done properly produces almost stoichimetric SiO 2 films with little SiOH, is quite slow and prone to particulate contamination. Other sputtering techniques such as reactive sputtering, dual-ion sputtering, deposition by etching-enhanced reactive sputtering, etc. have been described but are not in common use in the BEOL for similar reasons as described above.…”
Section: Materials K > 33−34mentioning
confidence: 99%
“…Radio frequency (RF) bias sputtering of silica, which when done properly produces almost stoichimetric SiO 2 films with little SiOH, is quite slow and prone to particulate contamination. Other sputtering techniques such as reactive sputtering, dual-ion sputtering, deposition by etching-enhanced reactive sputtering, etc. have been described but are not in common use in the BEOL for similar reasons as described above.…”
Section: Materials K > 33−34mentioning
confidence: 99%