“…Radio frequency (RF) bias sputtering of silica, which when done properly produces almost stoichimetric SiO 2 films with little SiOH, is quite slow and prone to particulate contamination. − Other sputtering techniques such as reactive sputtering, dual-ion sputtering, deposition by etching-enhanced reactive sputtering, etc. have been described but are not in common use in the BEOL for similar reasons as described above.…”