2007
DOI: 10.1016/j.surfcoat.2006.03.068
|View full text |Cite
|
Sign up to set email alerts
|

The effects of grain boundary scattering on the electrical resistivity of single-layered silver and double-layered silver/chromium thin films

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
11
0

Year Published

2013
2013
2024
2024

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 28 publications
(13 citation statements)
references
References 19 publications
0
11
0
Order By: Relevance
“…The resistivity of thin Ag films decreases monotonically below 150 K (in Ref. to LN 2 temperature) and the apparent change of resistivity gradient takes place at lower temperatures, e.g., for Ag about 10–20 K . These observations indicate the dominant role of the Ag layer in carrier transport of AgHT multilayer.…”
Section: Resultsmentioning
confidence: 80%
See 2 more Smart Citations
“…The resistivity of thin Ag films decreases monotonically below 150 K (in Ref. to LN 2 temperature) and the apparent change of resistivity gradient takes place at lower temperatures, e.g., for Ag about 10–20 K . These observations indicate the dominant role of the Ag layer in carrier transport of AgHT multilayer.…”
Section: Resultsmentioning
confidence: 80%
“…At 293 K, the resistivity is 56 × 10 −6 Ωcm. This is over 35 times more than the resistivity value of bulk silver and about 6 times more than the value of a thin Ag layer of thickness around 10 nm . Multilayer film AgHT comprises also much thicker ITO layers.…”
Section: Resultsmentioning
confidence: 82%
See 1 more Smart Citation
“…2 includes also the evolution of the electrical resistivity ( ) with the layer thickness, for which a linear relationship t = at + b has been found. Such behaviour is related to the grain-boundary scattering that enables to increase the film resistivity with respect to the metal bulk value ( b ) in the form t = b t + C g , by means of the grain-boundary parameter C g = (3/2)( b b )nR g /(1 − R g ); being b the mean free path for electrons in the metal bulk, R g the reflection coefficient at the grain boundary, and n the thickness to grain size ratio that is taken as the unity in a first approximation [28,29]. For the present samples, the linear fit gives b = 1.6 × 10 −6 cm as the bulk silver resistivity and R g = 5% for the reflection coefficient assuming n = 1.…”
Section: Resultsmentioning
confidence: 99%
“…Moreover, Ag has low mechanical strength, which is why it has been used in integrated circuit interconnects, electrodes and optical mirrors [11].…”
Section: Introductionmentioning
confidence: 99%