1981
DOI: 10.1063/1.329507
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The electrical characteristics of InP Schottky diodes

Abstract: Articles you may be interested inEffects of sulfur passivation and rapid thermal annealing on the electrical properties of InP metal-insulator semiconductor Schottky diodes Abstract: Electrical characteristics of the InP surface Au-n + -type InP Schottky diodes have been fabricated using anodic oxidation and etching with aqueous HCl. The electrical characteristics are measured and discussed based upon the effects of surface states between the gate metal and semiconductor. Typical values of the barrier height, … Show more

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Cited by 12 publications
(4 citation statements)
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“…47 This value results much lower than that reported for bulk InP of 4.4 eV. As reported for InP-Au Schottky contacts, 48 the value of the electron affinity may vary spatially at the semiconductor surface due to some structural disorder such as nonstoichiometric and random distribution of In and P atoms. The affinity of the conditioned surface increases by χ = 0.44 eV due to the formation of In-Cl dipoles.…”
Section: Resultsmentioning
confidence: 65%
“…47 This value results much lower than that reported for bulk InP of 4.4 eV. As reported for InP-Au Schottky contacts, 48 the value of the electron affinity may vary spatially at the semiconductor surface due to some structural disorder such as nonstoichiometric and random distribution of In and P atoms. The affinity of the conditioned surface increases by χ = 0.44 eV due to the formation of In-Cl dipoles.…”
Section: Resultsmentioning
confidence: 65%
“…For the substrates that were only solvent cleaned, the contact formed between the n-InP and both the CdO and CdO:Sn exhibit Schottky behavior as shown in panel (a) of Figure . The pretreatment/cleaning of a semiconductor prior to contact material deposition can have a strong effect on the contact’s electronic properties. , To preclude the possibilities of trace organics being left at the interface prior to CdO deposition, the InP was O 2 plasma cleaned. The resulting contacts still exhibited Schottky behavior and were more resistive than those formed by solvent cleaning as shown in panel (b) of Figure .…”
Section: Resultsmentioning
confidence: 99%
“…Table 1 shows Schottky barrier Φ B and threshold voltage V th of SBDs using tungsten (W) as a metal, SBDs with 10% GaN replaced by In, and Ni/n-InP-based SBDs. [32][33][34][35][36][37][38][39][40][41] There are some problems such as formation of low-damage W/n-GaN Schottky barrier using high-melting tungsten and growth of GaN crystals with thickness of several hun- dred nanometers or more, but the table shows that using W/n-GaN and Ni/n-GaN Schottky junctions contributes to reduction of threshold voltage and power consumption of terahertz patch antennas using GaN-based SBDs.…”
Section: Detection With Gan-based Sbdmentioning
confidence: 99%
“…As regards reduction of Schottky barrier and threshold voltage, one can think of using metals with work function Φ m smaller than that of Ni employed as anode, or using semiconductors with electron affinity χ higher than that of GaN, thus enabling low‐power operation. Table 1 shows Schottky barrier Φ B and threshold voltage V th of SBDs using tungsten (W) as a metal, SBDs with 10% GaN replaced by In, and Ni/n‐InP‐based SBDs 32–41 . There are some problems such as formation of low‐damage W/n‐GaN Schottky barrier using high‐melting tungsten and growth of GaN crystals with thickness of several hundred nanometers or more, but the table shows that using W/n‐GaN and Ni/n‐GaN Schottky junctions contributes to reduction of threshold voltage and power consumption of terahertz patch antennas using GaN‐based SBDs.…”
Section: Structure Of Gan‐based Terahertz‐band Antennamentioning
confidence: 99%