The generic nature of the Smart-Cut® process for thin film transfer

High-Overtone Bulk Acoustic Resonator

“…The development of the so-called Silicon On Insulator (SOI (TM) ) wafers has demonstrated the huge opportunities offered by the Smart Cut (TM) approach [12]. Moreover, its application for transferring single crystal Lithium Niobate thin layer into silicon proved to be effective for SAW device development [13].…”

Lattice Strain Measurements in Hydrogen Implanted Materials for Layer Transfer Processes

“…However, because of its higher weight, helium produces more defects in the lattice and bigger exfoliated area. Hydrogen is more often used for a lot of semiconductors such as Si (Höchbauer et al, 1999), Ge (Zahler et al, 2007), SiC (Malouf et al, 2005), InP (Aspar et al, 2001), .…”

SOI Technology Driving the 21st Century Ubiquitous Electronics

“…Eventually the Smart Cut™ technology, based on Bruel's invention [4] are typically used for splitting of silicon. For manufacturing SOI structures, the implanted surface is bonded to another wafer and splitting is achieved along the implanted zone [13]. The net result is that a thin layer of Si, defined precisely by the implant depth, is transferred from a donor wafer to a handle wafer.…”