The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics

Bar‐Cohen, Avram; Asheghi, Mehdi; Chainer, Timothy; Garimella, Suresh V.; Goodson, Kenneth E.; Gorlé, Catherine; Mandel, Raphael; Maurer, Joseph; Ohadi, Michael M.; Palko, James W.; Parida, Pritish R.; Peles, Yoav; Plawsky, Joel L.; Schultz, Mark; Weibel, Justin A.; Joshi, Yogendra

doi:10.1109/tcpmt.2021.3111114

Cited by 44 publications

(8 citation statements)

References 61 publications

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“…The application of phase-change materials (PCMs) as coolants has been extensively studied in the past decades [17], [18]. Bar-Cohen et al [19] report on the fundamentals of evaporative cooling physics and a numerical modeling approach to enable the co-design of such solutions in emerging computing and communications systems. Wu et al [20] propose the application of PCM inside the chip package instead of the conventional thermal interface material (TIM) layers.…”

Section: Introductionmentioning

confidence: 99%

A Novel Approach for Cooling Chiplets in Heterogeneously Integrated 2.5-D Packages Applying Microchannel Heatsink Embedded in the Interposer

Bognár

Takács

Szabó

2023

IEEE Trans. Compon., Packag. Manufact. Technol.

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Section: Introductionmentioning

confidence: 99%

A Novel Approach for Cooling Chiplets in Heterogeneously Integrated 2.5-D Packages Applying Microchannel Heatsink Embedded in the Interposer

Bognár

Takács

Szabó

2023

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…The miniaturization of electronic devices has led to the emergence of powerful localized heat sources with several micrometers in size, accumulations of local heat sources on a scale of several millimeters, and distribution of heat power over spaces of several square centimeters [2]. In new generation systems, it is necessary to incorporate cooling technologies that provide power semiconductor cooled with specific heat fluxes significantly more than 0.5 kW/cm 2 for hot spots with an area of less than 1 cm 2 .…”

Section: Introductionmentioning

confidence: 99%

“…Modern electronic devices require not exceeding the maximum permissible operating temperature locally, but also temperature uniformity throughout their body. An uneven temperature distribution will result in the formation of hotter zones, which can cause thermal stress and deformation, leading to fatigue failure of the device structure [2]. To exclude the formation of hot spots, a VC was proposed, which is a development of a flat heat pipe [12][13][14][15].…”

Section: Introductionmentioning

confidence: 99%

Modern possibilities of vapour chambers and other intensive cooling techniques. Comparative review

Pukhovoy,

Bykovskaya,

Kabov

2023

E3S Web Conf.

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Due to their high reliability, ease of manufacture, passive operation, and efficient heat transfer, vapor chambers (VC) are widely used for temperature management of modern electronic and power devices. This review considers all experimental works on the characterization of the thermal characteristics of VC, in the results of which the threshold in the removal of a specific heat flux of >0.1 kW/cm2 was overcome. This literature review, when compared with other cooling techniques, showed that they have not shown a noticeable increase in recent decades. Moreover, we should expect a qualitative increase in the capabilities of the VC and the expansion of their use. The principles of operation of modern VCs, often referred to as evaporation chambers, are also conceptually described.

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“…Specifically, excessive local heat fluxes (e.g. power amplifier hot spots exceeding 10 kW cm −2 heat flux [2]) create drastic thermal challenges, which are impossible to be handled by traditional approaches. These hot spots may be actively cooled down in situ by intra-chip liquid circulation by establishing proper microfluidics-based solutions [2].…”

Section: Introductionmentioning

confidence: 99%

“…power amplifier hot spots exceeding 10 kW cm −2 heat flux [2]) create drastic thermal challenges, which are impossible to be handled by traditional approaches. These hot spots may be actively cooled down in situ by intra-chip liquid circulation by establishing proper microfluidics-based solutions [2]. When intra-chip active liquid cooling could not be established, the heat from the hot spots should be transported to a wider heat removal area with a sufficiently small thermal resistance to eliminate the excessive temperature rise.…”

Section: Introductionmentioning

confidence: 99%

Interplay of capillary and Marangoni flows in micropillar evaporation

Yuncu¹,

Akkuş²,

Dursunkaya³

2022

Preprint

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Thin-film evaporation and the replenishing capillary liquid flow have paramount importance for various technological applications spanning from desalination to electronics cooling. With the developments enabling faster and cheaper yet more precise fabrication, evaporators with micropillar arrays have attracted substantial attention to sustain efficient evaporation fed by passive liquid transport. Although considerable effort has been devoted to designing optimized wicks, the full picture is still blurry due to complexities in modeling the liquid-vapor interface and the flow around the micropillars. Fundamentally, the heat transfer from a micropillar wick evaporator is a problem governed by various interfacial phenomena such as the capillarity induced liquid flow, thin-film evaporation intensifying near the contact lines, and thermocapillarity induced Marangoni flow. However, past works have not been able to assess the effect Marangoni flow due to the missing coupling between cell-and device-level modeling. In this work, we develop a comprehensive model for the evaporation from a micropillar wick evaporator by coupling the liquid flow with the energy transfer in both liquid and solid domains at both cell-and devicelevels. The model is successfully validated with previous experiments. When Ma number is sufficiently high, the model identifies a sharp reduction in the evaporator temperature attributed to the thermocapillary convection creating circulations beneath the liquidvapor interface. This temperature reduction cannot be identified when thermocapillarity is switched off in the model and the model's prediction substantially deviates from the experimental measurement. Therefore, the current study reveals a hitherto unexplored role of Marangoni flow in the evaporation of water from micropillar wick evaporators. We believe that the proposed modeling framework can guide the engineers for the optimization of micro-post evaporators by accounting for all the relevant interfacial phenomena.

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The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics

Cited by 44 publications

References 61 publications

A Novel Approach for Cooling Chiplets in Heterogeneously Integrated 2.5-D Packages Applying Microchannel Heatsink Embedded in the Interposer

A Novel Approach for Cooling Chiplets in Heterogeneously Integrated 2.5-D Packages Applying Microchannel Heatsink Embedded in the Interposer

Modern possibilities of vapour chambers and other intensive cooling techniques. Comparative review

Interplay of capillary and Marangoni flows in micropillar evaporation

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