The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy

Niranjani, V.L.; Rao, B.S.S. Chandra; Sarkar, Rajdeep; Kamat, S.V.

doi:10.1016/j.jallcom.2012.07.044

Cited by 35 publications

(14 citation statements)

References 30 publications

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“…In general, the strengthening effect in nanocomposites is dependent upon the volume fraction of the reinforcement, inter-particle spacing, particle size, and distribution in the matrix. The inter-particle spacing, λ , can be calculated using the following equation: 29 where f is the volume fraction of the reinforcement particles and d p is the average size of the particles. According to equation (1), high volume fraction of nanoparticles greatly reduces the inter-particle spacing which in turn increases the hardness.…”

Section: Resultsmentioning

confidence: 99%

“…According to equation (1), high volume fraction of nanoparticles greatly reduces the inter-particle spacing which in turn increases the hardness. The latter is due to Orowan strengthening 29–31 upon which dislocation movement is decreased in the matrix because of larger number of closely spaced nano-size particles (obstacles) against the dislocation movements; that is, when the particles' spacing is small travel distance that dislocations may glide between particles becomes smaller while the forces that cause them to climb/cross slip (particle-by-passing stresses) become larger.…”

Section: Resultsmentioning

confidence: 99%

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Depth sensing indentation of magnesium/boron nitride nanocomposites

Haghshenas

Islam

Wang

et al. 2018

Journal of Composite Materials

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Magnesium nanocomposites, considered as energy-saving lightweight materials of future, are a fairly new family of composite materials with enhanced specific strength and ductility compared to pure magnesium and/or magnesium alloys. In the present study, time-dependent plastic deformation of novel light-weight magnesium/boron nitride nanocomposites containing 0.5, 1.5 and 2.5 vol% of nano-boron nitride particulates is studied through a depth-sensing indentation approach against monolithic pure magnesium. The synthesis of magnesium–boron nitride nanocomposites was accomplished using powder metallurgy technique coupled with microwave sintering, followed by hot extrusion (end products are 8-mm diameter rods). The depth sensing indentation creep tests were conducted at room temperature (∼0.32Tm of magnesium) using an instrumented indentation platform via a self-similar pyramidal (Berkovich) indenter. To assess the influence of loading rate on the indentation-induced deformation behavior of the materials, a dual stage indentation creep including a constant loading rate followed by a constant load-holding scheme was used; indentation tests were performed on the specimens. The specimens were loaded at rates of 0.05, 0.5, 5, and 50 mN/s to a peak load of 50 mN then force was held constant for 400 s while load/displacement/time data were recorded continuously. The results of the depth sensing indentation tests were correlated and explained using the microstructural characteristics placing special emphasis on the volume fraction of reinforcement and the indentation loading rate. Finally, the controlling creep mechanisms of the magnesium–boron nitride nanocomposites and the base metal (pure magnesium) were discussed in the present paper. The results of this paper can be used as a baseline for high-temperature creep analysis of magnesium–boron nitride nanocomposites which is of engineering significance.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Depth sensing indentation of magnesium/boron nitride nanocomposites

Haghshenas

Islam

Wang

et al. 2018

Journal of Composite Materials

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“…Niranjani et al [67] observed that the hardness and creep resistance of the composite solder have been improved with the addition amount of 0.5 wt% Ni nanoparticles. Yao et al [68] and Tay et al [17] reported that Ni-containing composite solders possessed better wettability.…”

Section: Effect Of Nanoparticle Addition On Sac–x/cu Joint Interfacementioning

confidence: 99%

“…These IMC particles dispersed in the β -Sn solder matrix which can prevent grain boundary sliding and restrict the dislocation movement of the bulk solder [67]. …”

Section: Effect Of Nanoparticle Addition On Sac–x/cu Joint Interfacementioning

confidence: 99%

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Tan

Yusof

2015

Science and Technology of Advanced Materials

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Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.

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“…[18,[20][21][22][23] However, to the best of our knowledge, there are no literature data related to the structure and thermophysical properties of nanocomposite SAC solders with nano Ni additions in the liquid state after melting. In this work, we carried out investigations of the electrical conductivity of nanocomposite SAC in the liquid state.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

Yakymovych

Plevachuk

Sklyarchuk

et al. 2017

J. Phase Equilib. Diffus.

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The electrical conductivity of nanocomposite Sn-3.0Ag-0.5Cu alloys with two different weight percentages of Ni nanoparticles (1.0 and 2.0 wt.%) was measured over a wide temperature range. The samples were produced using a cold pressing method: Sn-3.0Ag-0.5Cu powder and Ni nanopowder were mechanically mixed and pressed into 8 mm diameter rods. Ni nanoparticles were synthesized via a chemical reduction method and characterized by a core/ shell structure. Temperature dependencies of the electrical conductivity revealed a hysteresis between the heating and cooling curves in a wide temperature range above the melting temperature. This fact is connected with structure transformations accompanied by a dissolution of Ni nanoparticles, which should be retarded due to an oxide/ hydroxide shell on the surface of the nanoparticles. A microstructure analysis of the samples in the solid state showed a fine distribution of intermetallic compounds in the Sn-based matrix. The Ni atoms substituted for Cu atoms in the Cu 6 Sn 5 compound forming a (Cu,Ni) 6 Sn 5 phase.

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The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy

Cited by 35 publications

References 30 publications

Depth sensing indentation of magnesium/boron nitride nanocomposites

Depth sensing indentation of magnesium/boron nitride nanocomposites

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

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