2016
DOI: 10.1007/s11665-016-2332-9
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The Influence of Thermal Conductivity of Die Material on the Efficiency of Hot-Stamping Process

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Cited by 11 publications
(1 citation statement)
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“…Despite these achievements, the range of applications of such cooling systems is inevitably restricted by their complex design and the high costs of manufacturing and maintenance. In a different approach, Li et al [40] recently experimentally and numerically investigated the influence of thermal conductivity of dies on the cooling behaviour and final product performance, using five dies with different thermal conductivities. Their results showed that the cooling performance and formability were significantly improved by increasing the thermal conductivity of the die, showing the feasibility of this approach.…”
Section: Advanced Stamping and Die Quenching Technologiesmentioning
confidence: 99%
“…Despite these achievements, the range of applications of such cooling systems is inevitably restricted by their complex design and the high costs of manufacturing and maintenance. In a different approach, Li et al [40] recently experimentally and numerically investigated the influence of thermal conductivity of dies on the cooling behaviour and final product performance, using five dies with different thermal conductivities. Their results showed that the cooling performance and formability were significantly improved by increasing the thermal conductivity of the die, showing the feasibility of this approach.…”
Section: Advanced Stamping and Die Quenching Technologiesmentioning
confidence: 99%