The MEMS-Based Electrochemical Seismic Sensor With Integrated Sensitive Electrodes by Adopting Anodic Bonding Technology

Xu, Chao; Wang, Junbo; Chen, Deyong; Chen, Jian; Liu, Bowen; Qi, Wenjie; Liang, Tian; She, Xu

doi:10.1109/jsen.2021.3096496

Cited by 8 publications

(5 citation statements)

References 23 publications

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“…In particular, this result shows that the deposition of a dielectric on one of the sides of the cathode can increase the sensitivity of classical transforming structures made of mesh electrodes, as well as modern conversion elements, such as those presented in [ 19 , 33 , 34 ]. In the design proposed in [ 19 ], which was further improved in [ 33 , 34 ], the anode is located on one side of the silicon wafer, and the cathode is partially located on the same side of the wafer, partially on the sides of the holes connecting the sides of the wafer, and most of it is on the opposite side of the plate. The result obtained in this work shows that the conversion coefficient for such a design can be significantly increased if the reverse side of the plates is isolated.…”

Section: Discussionmentioning

confidence: 90%

Influence of the Dielectric Coating of the Outer Side of the Cathode in the Anode–Cathode Pairs of a Molecular Electronic Sensitive Element on the Conversion Coefficient

et al. 2022

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Molecular electronic sensors of motion parameters use miniature electrochemical cells as a sensitive element, in which the interelectrode current is sensitive to external mechanical influences. New approaches for creating conversion elements are based on precision methods of micromachining materials. The use of new technologies has opened up the possibility of creating sensitive elements with configurations that have not been previously studied, and for which there is no clear understanding of the regularities that determine the output parameters depending on the geometry of the conversion elements. This work studies the influence of the dielectric coating on the surface of the cathodes on the conversion coefficient. The transforming structure has been made from three plates. The outer plates were an anode–cathode electrode pair. The middle plate served as a separator between the pairs of electrodes. It was found that an insulating layer on the side of the cathode facing away from the adjacent anode allows the conversion factor to be doubled. This result is applicable for a wide class of conversion elements made with microelectronic technologies, as well as structures made of mesh electrodes.

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Section: Discussionmentioning

confidence: 90%

Influence of the Dielectric Coating of the Outer Side of the Cathode in the Anode–Cathode Pairs of a Molecular Electronic Sensitive Element on the Conversion Coefficient

et al. 2022

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“…In order to test the performance of the electrochemical seismic sensor with four-electrode integration in this study, the commercial electrochemical seismic sensor CME6011 and the electrochemical seismic sensor with the planar four-electrode integrated structure [ 19 ] were selected for comparison. The seismic sensor was placed on a shaking table where the sine wave with predefined frequencies was generated by a signal generator and amplified by a power amplifier to create the vibration signal.…”

Section: Resultsmentioning

confidence: 99%

“…The electrochemical link was simulated where the external vibration frequency was fixed at 1 Hz, and the input speed was changed to verify whether the differential current output of cathodes was normal. At the same time, the integrated structure with four planar electrodes [ 19 ] was selected for comparison. The simulation results are shown in Figure 3 a.…”

Section: Simulationmentioning

confidence: 99%

“…However, the two wafers still needed to be manually aligned and assembled [ 18 ]. In a subsequent study, Xu proposed the integrated electrodes, which employed a three-layer anodic bonding structure of silicon-glass-silicon, served as the substitutes for multilayer manual assembly structures [ 19 ]. However, the process was complex, and the yield was low.…”

Section: Introductionmentioning

confidence: 99%

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A MEMS Electrochemical Seismometer Based on the Integrated Structure of Centrosymmetric Four Electrodes

Duan

Zhong

et al. 2022

Micromachines

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This paper presented an electrochemical seismic micro sensor based on an integrated structure of four centrosymmetric electrodes. In this integrative structure, cathodes were not only distributed on wafer surfaces but also on the inner walls of the flow holes of the wafer, which increased the effective cathode areas and improved the sensitivity of the sensor. Numerical simulations were conducted to validate the feasibility of the integrated structure of four centrosymmetric electrodes in monitoring seismic vibrations where variations in the arrangements of the flow holes and anode width were investigated. The integrated structure of the four centrosymmetric micro electrodes was fabricated based on Micro-Electro-Mechanical Systems (MEMS) without the requirement of manual alignments. Experimental characterizations revealed that: (1) the maximum sensitivity of the electrochemical seismic sensor based on the integrated structure of four centrosymmetric electrodes was two orders of magnitude higher than that of the commercial counterpart of CME6011 and three times higher than the electrochemical seismic sensor based on the integrated structure of four planar micro electrodes; (2) the electrochemical seismic sensor based on the integrated structure of four centrosymmetric micro electrodes demonstrated comparable and even lower noise levels in comparison to CME6011. Thus, the electrochemical seismic micro sensor developed in this study may function as an enabling tool in future applications of seismic monitoring and geophysical explorations.

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“…are feasible. Wafer-level fabrication of 2-and 3-wafer stacks [33], electrically actuated valves with the capillary flow, and self-venting microstructures for programmable, bubble-free liquid operations on-a-chip were demonstrated [34]. Another example, based on dry film resist technology on polyimide, shows multiplexed microfluidic EC biosensing platform for amplification-free, parallel detection of miRNAs using thin film Pt and Ag/AgCl electrodes (Figure 2a) [10].…”

Section: Design and Fabrication Of Microfluidics Integrated With Elec...mentioning

confidence: 99%

Microfluidic devices for photo-and spectroelectrochemical applications

Bogdanowicz

Jönsson-Niedziółka

Vereshchagina

et al. 2022

Current Opinion in Electrochemistry

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The MEMS-Based Electrochemical Seismic Sensor With Integrated Sensitive Electrodes by Adopting Anodic Bonding Technology

Cited by 8 publications

References 23 publications

Influence of the Dielectric Coating of the Outer Side of the Cathode in the Anode–Cathode Pairs of a Molecular Electronic Sensitive Element on the Conversion Coefficient

Influence of the Dielectric Coating of the Outer Side of the Cathode in the Anode–Cathode Pairs of a Molecular Electronic Sensitive Element on the Conversion Coefficient

A MEMS Electrochemical Seismometer Based on the Integrated Structure of Centrosymmetric Four Electrodes

Microfluidic devices for photo-and spectroelectrochemical applications

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