The National Electronics Manufacturing Initiative (NEMI) plug and play factory project

Dugenske, Andrew; Fraser, Alister; Nguyen, T. V.; Voitus, R.

doi:10.1080/095119200129876

Cited by 27 publications

(15 citation statements)

References 2 publications

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“…XML, internet) are being used commonly to overcome these issues to support generic connections between equipment from multiple vendors [26]. In order to accomplish this type of integration, the Institute for Interconnecting and Packaging Electronic Circuits (IPC)…”

Section: Existing Research On Failure Modelling Within Enterprise Modmentioning

confidence: 99%

Combining business process and failure modelling to increase yield in electronics manufacturing

Segura-Velandia

Conway

Monfared

et al. 2010

Proceedings of the Institution of Mechanical Engineers, Part B:

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The prediction and capturing of defects in low-volume assembly of electronics is a technical challenge that is a prerequisite for design for manufacturing (DfM) and business process improvement (BPI) to increase first-time yields and reduce production costs. Failures at the component-level (component defects) and system-level (such as defects in design and manufacturing) have not been incorporated in combined prediction models. BPI efforts should have predictive capability while supporting flexible production and changes in business models. This research was aimed at the integration of enterprise modelling (EM) and failure models (FM) to support business decision making by predicting system-level defects. An enhanced business modelling approach which provides a set of accessible failure models at a given business process level is presented in this article. This model-driven approach allows the evaluation of product and process performance and hence feedback to design and manufacturing activities hence improving first-time yield and product quality. A case in low-volume, high-complexity electronics assembly industry shows how the approach leverages standard modelling techniques and facilitates the understanding of the causes of poor manufacturing performance using a set of surface mount technology (SMT) process failure models. A prototype application tool was developed and tested in a collaborator site to evaluate the integration of business process models with the execution entities, such as software tools, business database, and simulation engines. The proposed concept was tested for the defect data collection and prediction in the described case study.

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Section: Existing Research On Failure Modelling Within Enterprise Modmentioning

confidence: 99%

Combining business process and failure modelling to increase yield in electronics manufacturing

Segura-Velandia

Conway

Monfared

et al. 2010

Proceedings of the Institution of Mechanical Engineers, Part B:

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show abstract

“…In this regard, the notable strategies are: the Service-Oriented Architecture approach (IBM 2005, OASIS 2006, Jammes 2005b, the TORERO device-centric approach (Torero, 2004, Torero 2005, and the NEMI plug-and-play factory project (Dugenske 2000, CAMX 2001, Dugenske 2001 based on a communication-centric approach. Three major existing initiatives can be described within the scope of a device centric approach to factory automation, namely the ODVA architecture, the PROFInet architecture and the SIRENA architecture.…”

Section: Current Automation Architecturesmentioning

confidence: 99%

“…The NEMI plug-and-play factory project (Dugenske, 2000,CAMX 2001, Dugenske, 2001) defines a framework for standard communications between electronic devices. This framework is based on the standard language XML and the resulting technology is called CAMX.…”

Section: Current Automation Architecturesmentioning

confidence: 99%

RI-MACS: an innovative approach for future automation systems

Checcozzo¹,

Rusina

Mangeruca³

et al. 2009

IJMMS

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“…Attempts to overcome these integration issues have resulted in the development of "plug and play" factory enabling technologies (e.g. the Extensible Markup Language (XML), internet) that aim at supporting generic connections between equipment from multiple vendors [6]. However, industry standards are needed to accomplish this integration for various manufacturing and assembly domains.…”

Section: Figure 2 Cloves Software Toolkit Conceptmentioning

confidence: 99%

Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufacture

Velandia

West

Conway

et al. 2008

2008 2nd Electronics Systemintegration Technology Conference

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The National Electronics Manufacturing Initiative (NEMI) plug and play factory project

Cited by 27 publications

References 2 publications

Combining business process and failure modelling to increase yield in electronics manufacturing

Combining business process and failure modelling to increase yield in electronics manufacturing

RI-MACS: an innovative approach for future automation systems

Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufacture

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