The relation between valency, axial ratio, Young’s modulus and resistivity of rapidly solidified tin-based eutectic alloys

El-Ashram, Tarek

doi:10.1007/s10854-005-2724-3

Cited by 17 publications

(13 citation statements)

References 3 publications

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“…Sn-23 wt.% Bi-5 wt.% Zn solders possess several fascinating features such as low cost as well as low reflow temperature of 450 K. In addition, Sn-23 wt.% Bi-5 wt.% Zn alloy offers better mechanical properties (high joining strength, good wettability) than the conventional Pb-Sn solders [4][5][6]. Directionally solidified Sn-23 wt.% Bi-5 wt.% Zn ternary alloy can be a suitable candidate for replacement of Pb-Sn solder due to its convenient mechanical and thermo-physical properties [7][8][9][10][11][12] and relatively low cost, however it needs more study. Thus the aims of present work were to study the dependency of microhardness, tensile stress and compressive stress on the solidification processing parameters (V and G) for directionally solidified Sn-23 wt.% Bi-5 wt.% Zn alloy and the variation of electrical property of Sn-23 wt.% Bi-5 wt.% Zn cast with the temperature in the range of 300-420 K.…”

Section: Introductionmentioning

confidence: 99%

Determination of mechanical, electrical and thermal properties of the Sn―Bi―Zn ternary alloy

Çadırlı

Böyük

Kaya

et al. 2011

Journal of Non-Crystalline Solids

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Section: Introductionmentioning

confidence: 99%

Determination of mechanical, electrical and thermal properties of the Sn―Bi―Zn ternary alloy

Çadırlı

Böyük

Kaya

et al. 2011

Journal of Non-Crystalline Solids

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“…Our ndings are in agreement with the ndings of Ashram. 40 Electrical resistivity of Sn-0.7Cu, Sn-0.7Cu-0.05Fe, Sn-0.7Cu-0.05Fe-1Bi and Sn-0.7Cu-0.05Fe-2Bi were also examined by varying the temperature. Variation in resistivity was examined within the range of 300-423 K. Fig.…”

Section: Resultsmentioning

confidence: 99%

Effect of temperature and alloying elements (Fe and Bi) on the electrical resistivity of Sn–0.7Cu solder alloy

et al. 2016

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In this paper, we investigated the electrical resistivity as a function of temperature of the Sn-0.7Cu solder alloy with the addition of Fe and Bi. The electrical resistivity were characterized by the four-point probe method. Apparent change in electrical resistivity was witnessed by the addition of both Fe and Bi. At room temperature, the electrical resistivity was found to be increased with the addition of Fe, as well as a further increase with the addition of Bi. Fe and Bi modified Sn-0.7Cu alloys also experienced the similar increasing trend when they were subjected to higher temperatures within the range of 300-423 K. Chemical state of Sn was analyzed by means of X-ray photoelectron spectroscopy (XPS). The results revealed the presence of Sn in Sn 2+ , Sn 4+ and state of metallic Sn. With the addition of Fe & Bi, a substantial decrease was observed in the atomic percent of the Sn 4+ chemical state. X-ray diffraction (XRD) was performed on the alloys. The XRD pattern showed disturbance in the 2 theta values with the addition of Bi. The disturbance confirmed the presence of stress and imperfections in the crystal lattice. Field emission scanning electron microscope (FESEM) micrographs revealed the formation of the FeSn 2 intermetallic compound with the addition of Fe. However, the addition of Bi promotes the formation of solid solution and goes into primary b-Sn dendrites. Microstructural changes, shifts in the chemical state of Sn and a disturbance in the XRD peaks resulting from the addition of Fe and Bi have been correlated to the variation in electrical resistivity.

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“…The intensive interest in these solder alloys is attributed to their low cost and unique material properties including high superplastic properties, low melting temperature, wettability, and good electrical conductivity. [7][8][9][10][11] Control of solidification processing parameters such as cooling rate and composition can permit a wide range of microstructures to be obtained.…”

Section: Introductionmentioning

confidence: 99%

Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100−x -Sn x Solders

Çadırlı

Kaya

Şahin

2011

Journal of Elec Materi

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Pb 100Àx -Sn x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward over a wide range of cooling rates _ T (0.016 K s À1 to 4.0 K s À1 ) by using a Bridgman-type directional solidification furnace. Microstructure parameters (primary dendrite arm spacing, k 1 , and eutectic spacing, k E ) and mechanical properties (microhardness, HV, and ultimate tensile strength, r) of the Pb 100Àx -Sn x alloys were measured. The dependences of the microhardness and ultimate tensile strength on the cooling rate, microstructure parameters, and composition were determined. According to experimental results, the microhardness and ultimate tensile strength of the solidified samples increase with increasing cooling rate and Sn content, but decrease with increasing microstructure parameters.

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The relation between valency, axial ratio, Young’s modulus and resistivity of rapidly solidified tin-based eutectic alloys

Cited by 17 publications

References 3 publications

Determination of mechanical, electrical and thermal properties of the Sn―Bi―Zn ternary alloy

Determination of mechanical, electrical and thermal properties of the Sn―Bi―Zn ternary alloy

Effect of temperature and alloying elements (Fe and Bi) on the electrical resistivity of Sn–0.7Cu solder alloy

Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100−x -Sn x Solders

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