The reliability assessment of flip chip components

Huang, Chien‐Yi

doi:10.1108/13565360410531962

Cited by 14 publications

(7 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Failure symptoms consist of solder cracks on both the component and PCB sides (Figure 4). This is attributed to the thermal stress incurred during thermal cycling for packaging materials with different coefficients of thermal expansion (CTE) (Teo, 1998; Park et al , 1998; Huang, 2004).…”

Section: Empirical Sample Testmentioning

confidence: 99%

Comparison of results from empirical ALT test to CAE simulation for wireless clients

Huang

Huang²

2011

Microelectronics International

View full text Add to dashboard Cite

Purpose -The purpose of this paper is to investigate how to reduce the time and cost required to conduct reliability testing. With increasing competition in the electronics industry and reduction in product life cycles, it is essential to diminish the time required for new product development and thus time to market. Design/methodology/approach -This study conducts empirical sample test for wireless card and analyzes the fatigue life through finite element modeling (FEM). Simulation results are compared to the data collected from a temperature cycling test under conditions of 2408C to 1508C and 2408C to 1008C. Findings -Assuming that the results of product lifetime from empirical sample test and software simulation exhibit a linear relationship, a "scale factor" should exist for any given product structure, process condition and materials composition scenario. The scale factors were found to be approximately 0.1 in both temperature cycling scenarios. Also, the effectiveness of various adhesive dispensing patterns on solder joint reliability is evaluated through software simulation. The L shape adhesive dispensing was proven to effectively enhance the fatigue life of chip scale package solder joints roughly 100-fold. Originality/value -The scale factor is used to convert the results from software simulation to empirical sample test for a given set of processing environments and materials. This helps to reduce the time and cost required to conduct reliability testing.

show abstract

Section: Empirical Sample Testmentioning

confidence: 99%

Comparison of results from empirical ALT test to CAE simulation for wireless clients

Huang

Huang²

2011

Microelectronics International

View full text Add to dashboard Cite

show abstract

“…Proper design of a thermal test vehicle is important and can often affect the thermal measurement and characterization results significantly (Goh et al , 2006). To evaluate the reliability performance of solder joints in microelectronic devices, various reliability tests are performed, which are time‐consuming (Zhong, 2001a; Huang, 2004). Therefore, another approach becomes popular and useful, which is to predict the fatigue life by simulating and analyzing the deformations, stresses and strains of microelectronics packages using finite element methods (Mackerle, 2002).…”

Section: Moiré and Fea For Advanced Packagesmentioning

confidence: 99%

Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

Zhong

Tee²,

Luan³

2007

Microelectronics International

View full text Add to dashboard Cite

PurposeThis paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.Design/methodology/approachOf the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.FindingsResearch on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.Research limitations/implicationsBecause of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.Originality/valueThis review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.

show abstract

“…To evaluate the reliability performance of solder joints in microelectronic devices, various reliability tests are performed, which are time-consuming [8,9]. Therefore, another approach becomes popular and useful, which is to predict the fatigue life by simulating and analyzing the deformations, stresses and strains of microelectronics packages using finite element methods [10,11].…”

Section: Introductionmentioning

confidence: 99%