The Reliability of Micro-Spring under Dynamic Circumstances

Abstract

This article mainly focuses on the reliability of micro-spring, which as a typical component of MEMS device, applies electrodeposited nickel material and is fabricated by LIGA process, being used under the circumstances like transporting and restoring which may induce shock and crash. Griffith theory of brittle fracture and Abaqus FEA simulation software are applied for analyzing the probable failure modes of the micro-spring as overloaded. And the principle of elastic deformation, energy-time and displacement-time variation curves are given by three groups of simulation experiments. It proves to be one novel method to evaluate the reliability and accelerate exposing the failure mode of these MEMS components under dynamic circumstances in short period. After comparison, this method is proved reliable for analyzing and providing evidence for enhancing the reliability of the micro-spring, also improving the performance in micron size.

Fracture mechanism of movable part in micro‐electro‐mechanical systems device based on empirical electron theory

“…The fracture of the movable part can cause the malfunction of MEMS device. Fracture failure of MEMS devices is an important factor that affects the reliability of the study [9][10][11][12][13][14]. The phenomenon of movable part fracture has been the focus of attention.…”