The Solder Life Prediction Model of Power Module under Thermal Cycling Test (TCT)

Chen, Hao-Chih; Guo, Siao-Wei; Liao, Hsueh-Kuo

doi:10.1109/impact.2018.8625778

Cited by 1 publication

(1 citation statement)

References 6 publications

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“…This has been ascribed to the solder crack growth due to fatigue caused by repeated solder creep [9]. According to previous research, design parameters of solder layer required for digital design utilising the finite element method (FEM) are proposed by a more practical model [10]. On the other hand, from other experimental testing results, two failure modes of HCT are observed at the same time; solder cracking and copper layers delamination from the DCB substrate ceramic layer [11].…”

Section: Introductionmentioning

confidence: 99%

Heat cycle failure point prediction by 3D thermal stress analysis for medium voltage power module

Takahashi

Jørgensen

et al. 2023

2023 IEEE Applied Power Electronics Conference and Exposition (APEC)

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The structural optimization of power modules for reliability can be performed without physical prototyping if the structural weakness in modules can be assessed on a 3D model. In this study, 3D thermal stress simulation is investigated as a predictive tool for the heat cycle test (HCT) failure point of the medium voltage power module. The module has a multilayer structure of two different ceramics (Al2O3 and AlN) to reduce the parasitic capacitance. In this complex structured module, the failure point of actual test samples are shown to coincide with weakness points of the thermo-mechanical stress in the 3D simulation. The heat cycle test (125/-40°C) was used for simulation and testing. The failure point of the module was predominantly copper delamination from the AlN substrate surface after HCT 100 cycles. The delaminated locations were matched to points in the simulation that has 2 characteristics, high peeling stresses points and high shape deformation of copper pattern at the simulation results. This observation applies to copper patterns only connected to the ceramics, while copper patterns connected to other adjacent layers did not follow this trend.

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Section: Introductionmentioning

confidence: 99%