The Study for Thermal Analysis Technology of Three-Dimension SRAM Component

Jiang, Tong; Liu, Jun; Lian, Binhao

doi:10.1109/icept.2007.4441402

Cited by 3 publications

(1 citation statement)

References 7 publications

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“…In addition, it has important significance to improve the reliability of MCM. Literatures [4]- [8] pointed out ANSYS can accurately simulate the 3-D temperature field distributions of MCM components. In [4] and [5], the error between the simulation results with ANSYS and the measurement results of 3-D temperature field distributions is 4.5% and 5.19%.…”

Section: Introductionmentioning

confidence: 99%

Study of Response Surface Methodology in Thermal Optimization Design of Multichip Modules

Zhang

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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A 3-D model of multichip module (MCM) is built with ANSYS and the temperature field distribution is studied. A regression equation describing the relationship of structure parameters and material properties with the maximum chip junction temperature of MCM is made, which integrates the response surface methodology and ANSYS. Quantitative analysis of the effect of four design parameters on the maximum chip junction temperature of MCM is studied. The four design parameters are the thickness of the substrate, thermal conductivity of the substrate, thermal conductivity of the thermal grease, and convection heat transfer coefficient, respectively. The accuracy and validity of the regression equation are validated by simulation with ANSYS. In addition, the maximum error between the calculation value of the regression equation and the simulation value with ANSYS is 0.541°C. With the regression equation, the thermal optimization design results of the four parameters are K t g = 5 W/m°C, δ = 2.5 mm, K s = 290 W/m°C, and h = 55 W/m 2°C , which lead to the maximum chip junction temperature T j max = 89.172°C as the minimum value. Index Terms-ANSYS, multichip module (MCM), optimization design, response surface methodology (RSM).

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Section: Introductionmentioning

confidence: 99%

Study of Response Surface Methodology in Thermal Optimization Design of Multichip Modules

Zhang

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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Thermal analysis of DC/DC power module based on innovative model with the application of active area loading

Pan

Liu

He³

et al. 2012

2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Thermal simulation and analysis play a significant role in development of new generation of DC/DC package design and system integration. This paper presents an innovative model for thermal simulation and analysis with the application of active area loading. In traditional model, resistor, inductor, transformer and similar components are usually simplified into a homogeneous body with the same size of package outline. In the current model, the detailed geometry and material are embodied, including the heating area referenced as active area loading. And according to the manufacturing process used for the component, the height of active area is computed by equivalent method.For comparisons, the innovative model and traditional model were developed for the same DC/DC power module with the application of Pro/E software. And the thermal simulation and analysis were processed in the platform of ANSYS Workbench. Under the same boundary conditions and heat convection coefficient, the thermal distributions of DC/DC module were predicted in two models, and verified by infrared thermal images, which shows that the current model is more accurate.

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Thermal analysis of DC/DC module

Yuanchun

et al. 2009

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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The Study for Thermal Analysis Technology of Three-Dimension SRAM Component

Cited by 3 publications

References 7 publications

Study of Response Surface Methodology in Thermal Optimization Design of Multichip Modules

Study of Response Surface Methodology in Thermal Optimization Design of Multichip Modules

Thermal analysis of DC/DC power module based on innovative model with the application of active area loading

Thermal analysis of DC/DC module

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