2023
DOI: 10.1016/j.jcrysgro.2022.126954
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The transition of growth behaviors of moderate Sn fraction Ge1-xSnx (8 % < x < 15 %) epilayers with low temperature molecular beam epitaxy

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Cited by 3 publications
(4 citation statements)
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“…13 For both growth methods, the epitaxial breakdown is reported for compressively strained GeSn layers when the thickness and strain energy exceed a critical value. 14,15 In this work, we report on the investigation of the growth of GeSn/Ge by MBE using Sn flux and temperature gradients to increase the Sn content and material quality. The Sn and temperature gradients were specifically designed to reduce the diffusion of Sn under conditions of compressive strain.…”
Section: ■ Introductionmentioning
confidence: 99%
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“…13 For both growth methods, the epitaxial breakdown is reported for compressively strained GeSn layers when the thickness and strain energy exceed a critical value. 14,15 In this work, we report on the investigation of the growth of GeSn/Ge by MBE using Sn flux and temperature gradients to increase the Sn content and material quality. The Sn and temperature gradients were specifically designed to reduce the diffusion of Sn under conditions of compressive strain.…”
Section: ■ Introductionmentioning
confidence: 99%
“…The spontaneous relaxation, which occurs at a critical thickness, facilitates an enhanced incorporation of Sn. Meanwhile, for MBE growth, which requires a lower growth temperature (100–200 °C) and typically lower growth rate, the GeSn layers exhibit fully or partially strained growth for relatively higher Sn content . For both growth methods, the epitaxial breakdown is reported for compressively strained GeSn layers when the thickness and strain energy exceed a critical value. , …”
Section: Introductionmentioning
confidence: 99%
“…Non-equilibrium deposition techniques * Author to whom any correspondence should be addressed. such as molecular beam epitaxy (MBE) [13][14][15][16], chemical vapor deposition (CVD) [17][18][19] and sputtering epitaxy [20,21] etc have been utilized to explore deposition of direct bandgap GeSn alloys.…”
Section: Introductionmentioning
confidence: 99%
“…Due to the low deposition rate, MBE of GeSn has to be conducted under low temperatures (typically <200 • C) to avoid Sn segregation [13,14]. Although Sn-rich GeSn can be obtained, the low-temperature deposition process results in kinetic roughing of the GeSn surface, which gradually leads to epitaxy breakdown [15] and/or hinders relaxation of the compressive strain in the GeSn film [16]. For these reasons, efficient light emission of MBE-grown GeSn is still under development [25][26][27].…”
Section: Introductionmentioning
confidence: 99%