The use of copper powders recycled from printed wire boards to manufacture a conductive epoxy adhesive

Hong, Seok Cheol; Ho, Ming-Chi

doi:10.1080/10934529909376946

Cited by 7 publications

(3 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Also the replacement of expensive Ag flakes by new metal flakes is required for wide use of ICAs instead of solder materials. Copper can be a conductive filler metal due to its low resistivity, low cost and improved electromigration performance, but oxidation causes this metal to lose its conductivity [19].…”

Section: Icas For Flip Chip Interconnectsmentioning

confidence: 99%

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Yim

Moon

et al. 2008

Journal of Adhesion Science and Technology

159

View full text Add to dashboard Cite

Electrically Conductive Adhesives (ICAs: Isotropic Conductive Adhesives; ACAs: An-isotropic Conductive Adhesives; and NCAs: Non-conductive Adhesives) offer promising material solutions for fine pitch interconnects, low cost, low-temperature process and environmentally clean approaches in the electronic packaging technology. ICAs have been developed and used widely for traditional solder replacement, especially in surface mount devices and flip chip application. These also need to be lower cost with higher electrical/mechanical and reliability performances. ACAs have been widely used in flat panel display modules for high resolution, lightweight, thin profile and low power consumption in film forms (Anisotropic Conductive Films: ACFs) for last decades. Multi-layered ACF structures such as double and triple-layered ACFs were developed to meet fine pitch interconnection, low-temperature curing and strong adhesion requirements. Also, ACAs have been attracting much attention for their simple and lead-free processing as well as cost-effective packaging method for semiconductor packaging applications. High mechanical reliability, good electrical performance at high frequency level and effective thermal conductivity for high current density are some of required properties for ACF materials to be pursued for a wide usage in flip chip technology. Recently, NCAs are becoming promising for ultra-fine pitch interconnection and low cost joining materials in electronic packaging applications.In this paper, an overview of the recent developments and applications of electrically conductive adhesives for electronic packaging with focus on fine pitch capability, electrical/mechanical/thermal performance and wafer level packaging application is presented.

show abstract

Section: Icas For Flip Chip Interconnectsmentioning

confidence: 99%

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Yim

Moon

et al. 2008

Journal of Adhesion Science and Technology

159

View full text Add to dashboard Cite

show abstract

“…Copper can be a promising candidate for conductive filler metal, due to its low resistivity, low cost and improved electro-migration performance, but oxidation causes this metal to lose its conductivity. 7 There are, basically, two approaches to surface treatment on copper fillers for ICA application. One is inorganic material coating, and the other is organic material coating.…”

Section: Introductionmentioning

confidence: 99%

Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives

Yim

Moon

et al. 2007

Journal of Elec Materi

View full text Add to dashboard Cite

This paper describes the development and characterization of isotropically conductive adhesives (ICAs) incorporating copper (Cu) powders as electrically conductive fillers, along with a silane coupling agent for oxidation protection of copper powders, for environmentally friendly, low cost and high thermal reliability applications in microelectronics packaging. The effect of silane coupling agent materials and concentration on the electrical conductivity, thermal stability and reliability of Cu-filled ICAs was investigated for potential alternatives of conventional silver-filled ICAs. The surface characteristics of silane thin films on copper surfaces, such as their hydrophobicity and thermal stability, were also evaluated to compare the performance of antioxidant behaviors of different silane coupling agents for Cu-filled ICAs. The low contact resistance and high thermal stability of the contact resistance of Cufilled ICAs were achieved by addition of an optimized silane coupling agent. Greater thermal stability and improved reliability of Cu-filled ICAs under high temperature and humidity conditions were achieved with a silane coupling agent of high molecular weight and hydrophobicity. The bulk resistivity of~10-4 Xcm of Cu-filled ICAs was achieved with bimodal filler loading.

show abstract

“…However, it is susceptible to oxidation, which will deteriorate the electrical properties of the composite as a result of the nonconductive nature of such oxide layers. 20 Cu is readily oxidized at a low temperature, and has no self-protective layer to prevent further oxidation. [21][22][23] Therefore, the study of Cu oxidation and the development of techniques to prevent it are crucial to the application of electrically conductive Cu fillers.…”

Section: Introductionmentioning

confidence: 99%

Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

Nishikawa

Natsume

et al. 2009

Journal of Elec Materi

View full text Add to dashboard Cite

The use of copper powders recycled from printed wire boards to manufacture a conductive epoxy adhesive

Cited by 7 publications

References 15 publications

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives

Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

Contact Info

Product

Resources

About