Theoretical and experimental studies of laser lift-off of nonwrinkled ultrathin polyimide film for flexible electronics

Bian, Jing; Zhou, Laoboyang; Yang, Biao; Yin, Zhouping; Huang, Yuhang

doi:10.1016/j.apsusc.2019.143910

Cited by 41 publications

(25 citation statements)

References 40 publications

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“…In addition to liquid‐soluble (water or other chemical liquid) sacrificial layer, there is also a transfer method using laser to eliminate the sacrificial layer, [ 93 ] such as laser lift‐off (LLo), [ 97–99 ] laser microtransfer printing (LμTP), [ 100 ] laser pulse patterning, [ 101,102 ] and laser enhance adhesion, [ 103 ] which takes the advantages of high yield, success rate, and high efficiency.…”

Section: Techniques For Fabrication Of Deformable Curved Electronicsmentioning

confidence: 99%

Fabrication Techniques for Curved Electronics on Arbitrary Surfaces

Tian

Luo

et al. 2020

Adv Materials Technologies

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Curved electronics, which are better coordinated and blended with the natural world due to the characteristics of large contact area, high space adaptability, etc., have been widely used in a quantity of areas ranging from conformal curved antennas and sensors in detection and measurement, to artificial smart skin of aerospace. Recent developments in curved electronics have made an increasing progress to the historic drawbacks of conventional planar electronics, however significant challenges still exist. Here, the main kinds of conformal fabrication technologies, including transfer printing, assembly techniques, curved lithography, conformal inkjet printing, 3D printing, and laser direct writing, are reviewed to realize manufacturing deformable/undeformable electronics on curved or arbitrary surfaces. The processes and features of each technology are comprehensively summarized together with their progress and potential values. Finally, the challenges and opportunities for fabricating conformal electronics on arbitrary surfaces are also discussed.

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Section: Techniques For Fabrication Of Deformable Curved Electronicsmentioning

confidence: 99%

Fabrication Techniques for Curved Electronics on Arbitrary Surfaces

Tian

Luo

et al. 2020

Adv Materials Technologies

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“…Finally, the whole device, including the flexible PI substrate, is detached from the carrier substrate. The final step, the laser lift-off (LLO) process, is one of the key techniques of flexible electronics manufacturing and determines the production speed and yield of the process [ 10 , 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

et al. 2021

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Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp–Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp–Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of –CF3 functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.

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“…The active matrix (AM) mini‐LEDs full‐color display based on a glass substrate in our previous work was demonstrated that active matrix thin film transistor has a promising application for large‐size display 21 . Based on some researchs of flexible display technloy, utilized the glass substrate coated and cured and cured colorless PI substrate and laser lift off (LLO) process could be a candidate for flexible substrate 20,22‐24 …”

Section: Introductionmentioning

confidence: 99%

“…21 Based on some researchs of flexible display technloy, utilized the glass substrate coated and cured and cured colorless PI substrate and laser lift off (LLO) process could be a candidate for flexible substrate. 20,[22][23][24] In this study, an 8-inch flexible full-color mini-LED display was fabricated in combination red, green, and blue (RGB) mini-LED. The display adopted the colorless polyimide (CPI) as substrate, driven by active matrix (AM) indium-gallium-zinc oxide (IGZO) thin-film transistor (TFT).…”

mentioning

confidence: 99%

Highly transparent, ultra‐thin flexible, full‐color mini‐LED display with indium–gallium–zinc oxide thin‐film transistor substrate

Sun

Fan²,

Liu³

et al. 2020

J Soc Info Display

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Mini-LED and micro-LED are expected to be the next-generation display by virtue of their diverse applications. In this study, an 8-inch flexible mini-LED display was fabricated using an indium-gallium-zinc oxide (IGZO) thin-film transistor (TFT) backplane that adopted a top-gate structure, with a pixel pitch of 0.55 mm and a resolution of 320 x 160, 46 PPI. With colorless polyimide (CPI) as the substrate, the mini-LED panel has a thickness of less than 0.2 mm, and a transmittance is over 60%. The world's first 8-inch, full-color, flexible mini-LED with IGZO-TFT backplane is demonstrated.

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Theoretical and experimental studies of laser lift-off of nonwrinkled ultrathin polyimide film for flexible electronics

Cited by 41 publications

References 40 publications

Fabrication Techniques for Curved Electronics on Arbitrary Surfaces

Fabrication Techniques for Curved Electronics on Arbitrary Surfaces

Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

Highly transparent, ultra‐thin flexible, full‐color mini‐LED display with indium–gallium–zinc oxide thin‐film transistor substrate

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