Thermal analysis of a nano-pore silicon-based substrate using a YAG phosphor supported COB packaged LED module

Chuluunbaatar, Zorigt; Wang, C.; Kim, E.S.; Kim, N.Y.

doi:10.1016/j.ijthermalsci.2014.07.013

Cited by 18 publications

(5 citation statements)

References 12 publications

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“…Additionally, in terms of appearance, FC-LED filament bulbs are closer to incandescent lamps. With the state ban on incandescent lamps, FC-LED filament bulbs will gradually replace incandescent lamps [2][3][4]. In contrast with the ordinary filament, the FC-LED filament, which has a flexible aluminum substrate, can be bent at any angle to satisfy the requirements of different shapes.…”

Section: Introductionmentioning

confidence: 99%

Effect of Different Welding Methods on Flip-Chip LED (FC-LED) Filament Properties

Zou

et al. 2018

Applied Sciences

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This paper investigates the effect of two different welding methods, direct welding (DW) and vacuum furnace welding (VFW), on flip-chip light-emitting diode (FC-LED) filament properties. Shearing force, SEM, steady-state voltage, steady-state luminous flux, and change of photoelectric performance with aging time were employed to characterize the differences in filament properties between the two welding methods. The shearing test revealed that the average shearing force of the VFW group was higher than that of the DW group, but the two groups followed the standard. Furthermore, the microstructure of the VFW group fault was more smoother, and the voids were fewer and smaller based on the SEM test results. The steady-state voltage and luminous flux revealed that the VFW group had a more concentrated voltage and a higher luminous flux. The aging data revealed that the steady-state voltage change rate of both groups was not very different, and both luminous flux maintenance rates of the VFW group were higher than those of the DW group, but all were within the standard range. In conclusion, if there is a higher requirement for filament in a practical application, such as the filament is connected in series or in parallel and needs a higher luminous flux, it can be welded using vacuum furnace welding. If the focus is on production efficiency and the high performance of filaments is not required, direct welding can be used.

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Section: Introductionmentioning

confidence: 99%

Effect of Different Welding Methods on Flip-Chip LED (FC-LED) Filament Properties

Zou

et al. 2018

Applied Sciences

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“…Furthermore, sapphire substrate removal by laser lift-off (LLO) followed by wafer bonding or electroplating has been reported recently [6,7]. The fabricated devices can be transferred to a new substrate, such as a graphite substrate or silicon substrate [8,9], with high thermal stability and thermal conductivity. With regard to improving the VLED output power, the ohmic contact of both p-and n-electrodes shows significant effects on the VLED performance owing to its low contact resistance and good surface morphology [10].…”

Section: Introductionmentioning

confidence: 99%

Reliability study of Au-in solid-liquid interdiffusion bonding for GaN-based vertical LED packaging

Sung

Kim

2015

J. Micromech. Microeng.

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An In-rich Au-In bonding system has been developed to transfer vertical light-emitting diodes (VLEDs) from a sapphire to a graphite substrate and enable them to survive under n-ohmic contact treatment at 350 °C. The bonding temperature is 210 °C, and three intermetallic compounds are detected: AuIn, AuIn2, and γ phase. As a result, the remelting temperature increases beyond the theoretical value of 450 °C according to the Au-In binary phase diagram. In fact, reliability testing showed that joints obtained by rapid thermal annealing at 400 °C for 1 min survived whereas those obtained at 500 °C for 1 min failed. Finally, a GaN-based blue VLED was transferred to the graphite substrate by means of the proposed bonding method, and its average light output power was measured to be 386.6 mW (@350 mA) after n-ohmic contact treatment. This wafer-level bonding technique also shows excellent potential for high-temperature packing applications.

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“…Efficiency droop refers to a phenomenon in which the output efficiency decreases when the input power to the LED device rises above the critical point.One of the Cerium-doped garnet phosphors, YAG:Ce 3+ is well known as a high-stability phosphor material and has excellent chemical stability, high quantum yield, moisture resistance, and thermal expansion properties. A composite of silicone resin and phosphor is mostly used as a light conversion material for wLED 11,12 . However, in this case, the resin material is easily damaged or burned by the heat generated from the chip, resulting in performance degradation 13,14 .…”

mentioning

confidence: 99%

Preparation of high-quality YAG:Ce3+ ceramic phosphor by high-frequency induction heated press sintering methods

Kwon

Yoo

Choi

et al. 2022

Sci Rep

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This study investigates the characteristics of a ceramic phosphor (CP) for the converter of a high-power laser diode-based automobile headlamp synthesized by high-frequency induction heated press (HFP) sintering. The CP prepared by an HFP method exhibits remarkable optical properties that are comparable to spark plasma sintering. The effects of post-treatment process for controlling residual pores, as well as sintering temperature, sintering pressure and heating rate for optimization of the HFP sintering method, were studied. The HFP sintering process can be widely used in ceramics and lighting fields because it is designed relatively low cost compared to other techniques and exhibits excellent productivity.

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Thermal analysis of a nano-pore silicon-based substrate using a YAG phosphor supported COB packaged LED module

Cited by 18 publications

References 12 publications

Effect of Different Welding Methods on Flip-Chip LED (FC-LED) Filament Properties

Effect of Different Welding Methods on Flip-Chip LED (FC-LED) Filament Properties

Reliability study of Au-in solid-liquid interdiffusion bonding for GaN-based vertical LED packaging

Preparation of high-quality YAG:Ce3+ ceramic phosphor by high-frequency induction heated press sintering methods

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