Thermal Analysis of a Silicon Wafer Processing Combination Bake-Chill Station Used in Microlithography

Narasimhan, Arunn

doi:10.1081/amp-200042048

Cited by 9 publications

(4 citation statements)

References 10 publications

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“…The temperature and baking time of the photoresist film were 100 ∘ C and 10 min, respectively. Hard baking is performed after the development of the substrate to minimize outgassing [21] and improves the thermal and physical stability. Hard baking was performed at 120 ∘ C for 10 min.…”

Section: Methodsmentioning

confidence: 99%

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The Effect of the Rolling Direction, Temperature, and Etching Time on the Photochemical Machining of Monel 400 Microchannels

Patil

Sadaiah

2016

Advances in Materials Science and Engineering

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The present paper describes the effect of the rolling direction on the quality of microchannels manufactured using photochemical machining (PCM) of Monel 400. Experiments were carried out to fabricate microchannels along and across the rolling direction to investigate the effect of the grain orientation on microchannel etching. The input parameters considered were channel width and rolling direction, whereas the depth of etch was the response parameters. Different channels of widths of 60, 100, 150, 200, and 250 μm were etched. The effects of the etching time and temperature of the etchant solution on the undercut and depth of the microchannels were studied. For good quality microchannels, the effects of spinning time, spinning speed, exposure time, and photoresist film strength were also taken into consideration. Optimized values of the above were used for the experimentation. The results show that the depth of etch of the microchannel increases more along the rolling direction than across the rolling direction. The channel width and depth are significantly affected by the etching time and temperature. The proposed study reports an improvement in the quality of microchannels produced using PCM.

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Section: Methodsmentioning

confidence: 99%

“…After the development of the photoresist, the film was washed with distilled water to wash out residual developer solution and dried using filter paper. The process from the photoresist coating to washing out the developer is called the microlithography process [21].…”

Section: Methodsmentioning

confidence: 99%

The Effect of the Rolling Direction, Temperature, and Etching Time on the Photochemical Machining of Monel 400 Microchannels

Patil

Sadaiah

2016

Advances in Materials Science and Engineering

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“…Distributing reliable power, ground, data, address and other signals among IC chips and microelectronics devices through interconnections at such high speeds is a challenge (Kaushik et al , 2006). Precision machining/manufacturing of silicon, ceramic and polymer substrates (Zhong and Lee, 2001; Narasimhan, 2005; Zimmermann et al , 2005; Young et al , 2006; Zhong et al , 2006a; Schoenfelder et al , 2007), microelectronics packaging, and detection/analysis of various defects (Paehler et al , 2007) also face more and more new challenges.…”

Section: Introductionmentioning

confidence: 99%

Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

Zhong

Tee²,

Luan³

2007

Microelectronics International

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PurposeThis paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.Design/methodology/approachOf the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.FindingsResearch on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.Research limitations/implicationsBecause of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.Originality/valueThis review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.

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“…The developer used in this project was MF-321 by Shipley Inc. [44], and the wafers were immersed in the developer for 60 seconds for optimum pattern Upon developing the patterns, the wafer is hard baked. Hard baking is the process of post development heating of the wafers and UV-cross linking then to improve the etch resistance of the PR and minimize out-gassing [45]. The temperature and length of this heating step is critical in that overheating can melt the photoresist.…”

Section: Photoresist Spin Coating and Optical Lithographymentioning

confidence: 99%

Coupled interface modes for nonlinear interaction in periodic layered media

Arjmand

Abolghasem

Han

et al. 2010

2010 IEEE Photinic Society's 23rd Annual Meeting

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and nonlinear properties. Second harmonic generation is adopted for the demonstration of nonlinear interaction, due to its convenient experimental set-up. Three different laser sources are used to pump the waveguides and second harmonic light is generated and characterized. Coupled interface modes in conjunction with other types of modes also existing within the same structures, offer the possibility to explore three-wave mixing processes such as sum and difference frequency generation.ii

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Thermal Analysis of a Silicon Wafer Processing Combination Bake-Chill Station Used in Microlithography

Cited by 9 publications

References 10 publications

The Effect of the Rolling Direction, Temperature, and Etching Time on the Photochemical Machining of Monel 400 Microchannels

The Effect of the Rolling Direction, Temperature, and Etching Time on the Photochemical Machining of Monel 400 Microchannels

Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

Coupled interface modes for nonlinear interaction in periodic layered media

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