Thermal Analysis of LED Arrays for Automotive Headlamp With a Novel Cooling System

Jang, Sunho; Shin, Moo Whan

doi:10.1109/tdmr.2008.2002355

Cited by 46 publications

(9 citation statements)

References 6 publications

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“…Furthermore, the heat sink design is limited due to the space constraints inside the headlamp enclosure. To address these issues, a novel air-circulating cooling system was designed by Jang and Shin [113]. The operation of the air-circulating cooling system is illustrated in Fig.…”

Section: Systemmentioning

confidence: 99%

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Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Lundh

Shervin

et al. 2019

Journal of Electronic Packaging

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GaN-based high-power wide-bandgap semiconductor electronics and photonics have been considered as promising candidates to replace conventional devices for automotive applications due to high energy conversion efficiency, ruggedness, and superior transient performance. However, performance and reliability are detrimentally impacted by significant heat generation in the device active area. Therefore, thermal management plays a critical role in the development of GaN-based high-power electronic and photonic devices. This paper presents a comprehensive review of the thermal management strategies for GaN-based lateral power/RF transistors and light-emitting diodes (LEDs) reported by researchers in both industry and academia. The review is divided into three parts: (1) a survey of thermal metrology techniques, including infrared thermography, Raman thermometry, and thermoreflectance thermal imaging, that have been applied to study GaN electronics and photonics; (2) practical thermal management solutions for GaN power electronics; and (3) packaging techniques and cooling systems for GaN LEDs used in automotive lighting applications.

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Section: Systemmentioning

confidence: 99%

mentioning

confidence: 99%

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Lundh

Shervin

et al. 2019

Journal of Electronic Packaging

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“…To achieve a high flux level required in many lighting applications, several chips are integrated into a single package [27]. Moreover, manufacturing of LEDs with multiple chips has increased over the last few years due to increments in the thermal efficiency [36][37][38].…”

Section: B Four Flat Chips In the Central Planementioning

confidence: 99%

Light-emitting diode spherical packages: an equation for the light transmission efficiency

2009

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Virtually all light-emitting diodes (LEDs) are encapsulated with a transparent epoxy or silicone gel. Here we analyze the optical efficiency of spherical encapsulants. We develop a quasi-radiometric equation for the light transmission efficiency, which incorporates some ideas of Monte Carlo ray tracing into the context of radiometry. The approach includes the extended source nature of the LED chip and the chip radiance distribution. The equation is an explicit function of the size and the refractive index of the package, and also of several chip parameters such as shape, size, radiance, and location inside the package. To illustrate the use of this equation, we analyze several packaging configurations of practical interest, for example, a hemispherical dome with multiple chips, a flat encapsulation as a special case of the spherical package, and approximate calculations of an encapsulant with a photonic crystal LED or a photonic quasi-crystal LED. These calculations are compared with Monte Carlo ray tracing, giving almost identical values.

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“…These lamps require a high seal, shock resistance, and stability with a high ambient temperature and small space. Therefore, an effective thermal design is important to ensure the normal operation of LED headlights [29,30]. Therefore in order to improve the performance of LED automotive headlights, attention must be focused on providing the highest convective heat transfer coefficients possible within reasonable energy constraints while improving the cooling design.…”

Section: Introductionmentioning

confidence: 99%

Thermal management technology of high-power light-emitting diodes for automotive headlights

Yang²,

Zheng

et al. 2014

IEICE Electron. Express

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Abstract:The heat dissipation problem of high-power LEDs (Light-Emitting Diodes) limits their applications in automobile headlights. The heat demand for cooling LED headlights is analyzed based on heat transfer theory. This study proposes an initiative heat dissipation technology of temperature feedback control combined heat pipe and heat sink. The corresponding hardware and software control processes are designed. The temperature feedback control is realized with an MCU (Micro Control Unit) that judges and controls the synthetic jet device working process. A 3D model for the heat pipe radiator is constructed using CATIA. The model is optimized with the fluid thermodynamic simulation software FLOEFD. Finally, a sample lamp is prepared and tested with an infrared thermometer. The temperature distribution on each LED light source and radiator fin is quantitatively measured and analyzed. These results confirm that the designs of the thermal management system and the proposed technique solve the heat dissipation problem of high-power LED automotive headlights under the ambient temperature 50°C indeed.

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Thermal Analysis of LED Arrays for Automotive Headlamp With a Novel Cooling System

Cited by 46 publications

References 6 publications

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Light-emitting diode spherical packages: an equation for the light transmission efficiency

Thermal management technology of high-power light-emitting diodes for automotive headlights

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