Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization

Cuesta, David; Risco‐Martín, José L.; Ayala, José L.; Hidalgo, J. Ignacio

doi:10.1016/j.asoc.2015.04.052

Cited by 14 publications

(11 citation statements)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The TSV count, location, dimension, and thermal properties are considered as design parameters to enhance TSV heat transfer. Moreover, when the locations of TSVs are well aligned with other stacked chips, this could work as a thermal path from the heat source to the heat sink [38,[127][128][129][130][131][132][133][134]. For example, thermal TSVs (TTSVs), either integrated with thermal metamaterials or designed using metamaterial principles, can be placed close to hot spot regions to facilitate enhanced heat dissipation in 3D ICs Transactions of the ASME [135], following the principle laid out in Sec.…”

Section: Nonhomogeneousmentioning

confidence: 99%

“…For 3D packages, thermal metamaterials based on bending or shifting designs could be used to guide the heat efficiently toward heat sinks and facilitate heat dissipation through HBM stacks. Thermal management of 3D stacks could be further addressed by optimal arrangements of TSVs and potential use of silicon-based thermoelectric cooling elements [34,36,37,39,59,61,132,136]. Several studies discussed the potential use of thermal metamaterials for circuit designs [15,19,20,152].…”

Section: Cooling Capacities Of One Package To System Levelmentioning

confidence: 99%

See 1 more Smart Citation

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

View full text Add to dashboard Cite

Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects are important, as trends of electronics packaging toward higher power, higher density, and 2.5D/3D integration are making thermal management even more challenging. While conventional cooling solutions based on large thermal-conductivity materials as well as heat pipes and heat exchangers may dissipate the heat from a source to a sink in a uniform manner, thermal metamaterials could help dissipate the heat in a deterministic manner and avoid thermal crosstalk and local hot spots. This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated packaging challenges, this paper also discusses the implications of thermal metamaterials for the future of electronic packaging thermal management. Thermal metamaterials could provide a solution to nontrivial thermal management challenges. Future research will need to take on the new challenges in implementing the thermal metamaterial designs in high-performance heterogeneous packages to continue to advance the state-of-the-art in electronics packaging.

show abstract

Section: Nonhomogeneousmentioning

confidence: 99%

Section: Cooling Capacities Of One Package To System Levelmentioning

confidence: 99%

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

View full text Add to dashboard Cite

show abstract

“…Therefore, identifying and correcting the faulty TSVs is necessary to improve the overall yield rate. On the other hand, by having higher operating temperature and high temperature differences between layers [8], the thermal and stress impacts on 3D-ICs reliability are also critical, which can shorten the lifetime expectation. Consequently, there is an imperative need to not only improve the yield rate at the manufacturing phase but also on lifetime reliability due to the vulnerability to the thermal and stress of TSVs.…”

Section: Introductionmentioning

confidence: 99%

“…Despite having numerous methods to solve the reliability issues of TSVs, they mostly focus on offline testing and recovery in three phases: pre-bond, post-bond and postproduction. However, the high operating temperature is one of the critical issues of 3D-IC [8]. The fault rates are expected to exponentially accelerate with the operating temperatures in most academic and industry models [24], [25].…”

Section: Introductionmentioning

confidence: 99%

“…4) While adding redundancies [16], [17] for manufacturing defects considers the fault-rate as a uniform distribution, lifetime reliability of TSVs is heavily affected by the operating temperature [24], [25]. Since the temperature is also shown with a non-uniform distribution in 3D-ICs [8], designers must consider how we group TSVs to improve system reliability. Motivated by the above problems, TSV-based 3D-ICs desire to have a method to monitor, detect, localize, and recover from TSV defects.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems

et al. 2020

View full text Add to dashboard Cite

Through-Silicon-Via (TSV) based 3D Integrated Circuits (3D-IC) are one of the most advanced architectures by providing low power consumption, shorter wire length and smaller footprint. However, 3D-ICs confront lifetime reliability due to high operating temperature and interconnect reliability, especially the Through-Silicon-Via (TSV), which can significantly affect the accuracy of the applications. In this paper, we present an online method that supports the detection and correction of lifetime TSV failures, named IaSiG. By reusing the conventional recovery method and analyzing the output syndromes, IaSiG can determine and correct the defective TSVs. Results show that within a group, R redundant TSVs can fully localize and correct R defects and support the detection of R + 1 defects. Moreover, by using G groups, it can localize up to G × R and detect up to G × (R + 1) defects. An implementation of IaSiG for 32-bit data in eight groups and two redundancies has a worst-case execution time (WCET) of 5,152 cycles while supporting at most 16 defective TSVs (50% localization). By integrating IaSiG onto a 3D Network-on-Chip, we also perform a grid-search based empirical method to insert suitable numbers of redundancies into TSV groups. The empirical method takes the operating temperature as the factor of accelerated fault due to the fact that temperature is one of the major issues of 3D-ICs. The results show that the proposed method can reduce the number of redundancies from the uniform method while still maintaining the required Mean Time to Failure.

show abstract

An effective and efficient numerical method for thermal management in 3D stacked integrated circuits

Xiao

et al. 2017

Applied Thermal Engineering

View full text Add to dashboard Cite

Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization

Cited by 14 publications

References 14 publications

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems

An effective and efficient numerical method for thermal management in 3D stacked integrated circuits

Contact Info

Product

Resources

About