Thermal-aware reliability analysis of nanometer designs

Demachi

2016 International Conference on Microelectronic Test Structures (ICMTS)

et al. 2016

A test structure for analysis of temperature distributions and effects of metal wires on thermal properties in stacked IC is presented. The effects on the temperature distributions and transient phenomena in the single die and the stacked ICs were analyzed. The heat transfer in the metal wires affects the temperature distributions, which are consistent with the thermal simulation results. The test structure can provide an effective way for analysis of thermal properties in various LSIs.

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Section: Introductionmentioning

confidence: 99%

A test structure for analysis of metal wire effect on temperature distribution in stacked IC

Demachi

2016 International Conference on Microelectronic Test Structures (ICMTS)

et al. 2016

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A test structure for analysis of temperature distribution in CMOS LSI with sensing device array

Hanai

2013 IEEE International Conference on Microelectronic Test Structures (ICMTS)

et al. 2013

A test structure for analysis of temperature distribution in CMOS LSI is presented. Fundamental thermal properties of LSI chip were measured and discussed with simulation results. The test structure consists of 24 sensor blocks, each of which has a resistor as an on-chip heater, a p-n diode array for temperature sensing and selector switches. Dependence of heating time and distance from the resistor were analyzed as well as transient phenomena. The test structure can provide an effective methodology for analysis of fundamental thermal properties in LSIs packaged in various ways.

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A test structure for analysis of temperature distribution in stacked IC with sensing device array

Yamada

2014 International Conference on Microelectronic Test Structures (ICMTS)

et al. 2014