2009
DOI: 10.1016/j.compositesa.2009.02.024
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Thermal conductivity of polymer composites with close-packed structure of nano and micro fillers

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Cited by 171 publications
(75 citation statements)
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“…With the increasing of filler content, the thermal conductivity of composites increased slowly until the filler fraction reached a percolation threshold where a rapid increase in conductivity started [8]. Fillers had to form a random close-packed structure to maximize a pathway or network for heat conduction through the polymer matrix [9,10]. In the past researches, the effects of type, shape and size of fillers and interface thermal resistance on thermal performance of composites have been fully addressed.…”
Section: Introductionmentioning
confidence: 98%
“…With the increasing of filler content, the thermal conductivity of composites increased slowly until the filler fraction reached a percolation threshold where a rapid increase in conductivity started [8]. Fillers had to form a random close-packed structure to maximize a pathway or network for heat conduction through the polymer matrix [9,10]. In the past researches, the effects of type, shape and size of fillers and interface thermal resistance on thermal performance of composites have been fully addressed.…”
Section: Introductionmentioning
confidence: 98%
“…), a number of experimental attempts have been made. It was found that the thermal conductivity of polymer-based composites can be efficiently improved by introduction of conductive fillers, and can be influenced by the shape and content of the fillers in matrix [9][10][11][12]. At the same time, various semi-empirical or empirical models have been developed to qualitatively simulate the thermal conductivity of dual-phase polymer matrix composites [13][14][15][16][17][18][19][20][21][22].…”
Section: Introductionmentioning
confidence: 99%
“…Other researchers attempted to use carbon nanotubes as an additive for high thermal conductivity of the polymer composites because the fibrous form of nanotubes can allow heat transfer (or dissipation). 1,4,6,8,15 Among the ceramic fillers mentioned above, aluminum nitride (AlN) is a good filler for insulating resins due to the high thermal conductivity, low thermal expansion, and high electric resistivity. 16,17 On the other hand, the production of pure AlN nanofibers by chemical vapor decomposition (CVD) is difficult, and the final product is quite expensive.…”
Section: -9mentioning
confidence: 99%