Thermal Coupling Analysis in a Multichip Paralleled IGBT Module for a DFIG Wind Turbine Power Converter

Abstract

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An Extended Multilayer Thermal Model for Multichip IGBT Modules Considering Thermal Aging

“…13, it can also be understood that even at high airflow rates, faraway chips continue to create a significant cross-heating effect. This is in contrast to the findings in [38] where the authors demonstrated that the chips with a distance of more than 10 mm are no longer thermally coupled with any cooling system. As further research, Fig.…”

Power Loss Prediction for Aging Characteristics and Condition Monitoring for Parallel‐Connected Power Modules Using Nonlinear Autoregressive Neural Network

“…Parallel-connected power modules can start missions with almost the same thermal and electrical parameters at the beginning [19][20][21], but may vary over the entire operational life due to uneven degradation rates of aging. Differences in electrical and thermal parameters of individual devices can cause other failure mechanisms [22,23]. Therefore, if parallel-connected power devices are affected by different load currents, they will undergo different thermal cycles.…”

Improved Cauer thermal network considering thermal coupling effects of multi‐chip modules

“…However, the major drawback of these models is they did not solve thermal coupling problem, which will cause a significant problem in an intelligent power module (IPM). The 3D thermal network is also the proposed to consider both self‐heating and cross‐heating in the device, as detailed in [22–27]. In those network models, thermal behaviour is described using a Foster network, in which the R and C parameters are calculated through curve fitting of data got from FEM.…”