Thermal effects in suspended RF spiral inductors

Sagkol, H.; Sinaga, S.M.; Burghartz, Joachim N.; Rejaei, B.; Akhnoukh, A.

doi:10.1109/led.2005.852524

Cited by 11 publications

(6 citation statements)

References 9 publications

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“…6(b). These phenomena may be mainly caused by the increase in the series resistance Rs, which will increase the ohmic loss and then degrade the quality factor [6,7].…”

Section: Experiments Results and Discussionmentioning

confidence: 99%

Vertical Tapered Solenoidal Inductor with Zero Spacing

Kang

Shi

et al. 2006

2006 IEEE MTT-S International Microwave Symposium Digest

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Novel vertical tapered solenoidal inductors were designed, fabricated and analyzed in this paper. Due to vertical tapered solenoidal structure, the proposed inductor has small interwire capacitance between adjacent turns and overlap capacitance between the spiral and underpass, which can increase the self resonance frequency of the inductorW significantly. The spacing between adjacent turns of this inductor can be minimized to zero, which can save precious physical area on IC boards. For a compact structure, the proposed inductor also has higher inductance as compared with the normal spiral inductor of the same outer and inner dimensions. Index Terms CMOS, RFICs, spiral inductor, vertical tapered solenoidal inductor. (a)

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“…6(b). These phenomena may be mainly caused by the increase in the series resistance Rs, which will increase the ohmic loss and then degrade the quality factor [6,7].…”

Section: Experiments Results and Discussionmentioning

confidence: 99%

Vertical Tapered Solenoidal Inductor with Zero Spacing

Kang

Shi

et al. 2006

2006 IEEE MTT-S International Microwave Symposium Digest

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“…The self-heating of suspended coils degrades their RF performance by lowering their quality factor (Q) [20]. Fig.…”

Section: Detrimental Effects Of Self Heatingmentioning

confidence: 99%

“…As the integration of PAs is considered a viable direction by industry [1], it is important to study the compatibility of suspended inductors with power circuit integration. The most serious problem faced by suspended inductors in PA applications is self-heating due to the flow of a high dc or RF current [20]. The lack of an effective heat dissipation path, caused by the removal of the Si underneath the coil, leads to elevated temperatures inside the current carrying coil.…”

mentioning

confidence: 99%

Thermal Issues in Micromachined Spiral Inductors for High-Power Applications

Sagkol

Rejaei

Burghartz

2008

IEEE Trans. Electron Devices

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Abstract-An experimental study of the self-heating of micromachined spiral inductors operated under high-power conditions is presented. Typical suspended spiral coils are shown to develop highly elevated temperatures (up to several hundred degrees) under the flow of a moderate to high (> 60 mA) dc current, which often applies to inductors in radio frequency power circuits. This can lead to the degradation of quality factor and even device failure. The role of various heat dissipation mechanisms relevant for a suspended coil is discussed and analyzed by means of experiments and thermal simulations. Possible solutions to the self-heating issue are discussed and experimentally demonstrated.

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“…This technological progress is known with the electronic feature size shrinking and the density growth. In parallel to this spectacular development, the undesired electromagnetic compatibility (EMC) effects [2][3][4][5] and the different environmental effects [6][7][8][9][10][11][12][13][14][15] such as the humidity and the thermal influence become more and more unavoidable. Therefore, these physical aspects should be considered during the design and the fabrication of modern electric-and electronic-circuits.…”

Section: Introductionmentioning

confidence: 99%

Thermal Effect Modeling on Passive Circuits With MLP Neural Network for Emc Application

Bensetti¹,

Duval²,

Ravelo³

2011

PIER M

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During the last two decades, several simulation tools have been proposed for the modeling of electronic equipments in function of the physical environmental changes. It was stated that numerous electronic components such as semiconductor devices can be affected by the mechanistic effects, humidity or simply the temperature variations. To study the last effect, based on the multilayer perceptron neural network (MLPNN), a characterization method of the passive electronic device thermal effects is introduced in this paper. The method proposed was realized toward the equivalent circuit identification of the under test device (R, L, C components) measured input impedances. To demonstrate the relevance of the method, numerical computations with MLPNN algorithms implemented into Matlab were performed. First, a capacitor modeling from 30 kHz to 1 GHz for the temperature variation from 25 • C to 130 • C is presented. It was found that a good agreement between the proposed model and the measurement is observed. Then, a commercial EMI low-pass filter was also characterized in RF frequencies through the S-parameter identification. Finally, further discussion on the potential applications of this work, in particular, in the electromagnetic compatibility (EMC) field is offered in the last part of this paper.

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Thermal effects in suspended RF spiral inductors

Cited by 11 publications

References 9 publications

Vertical Tapered Solenoidal Inductor with Zero Spacing

Vertical Tapered Solenoidal Inductor with Zero Spacing

Thermal Issues in Micromachined Spiral Inductors for High-Power Applications

Thermal Effect Modeling on Passive Circuits With MLP Neural Network for Emc Application

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