2015
DOI: 10.1016/j.polymertesting.2015.04.009
|View full text |Cite
|
Sign up to set email alerts
|

Thermal expansion behavior of solar cell encapsulation materials

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
9
0

Year Published

2017
2017
2024
2024

Publication Types

Select...
8

Relationship

1
7

Authors

Journals

citations
Cited by 29 publications
(9 citation statements)
references
References 9 publications
0
9
0
Order By: Relevance
“…Moreover, the different thermal expansion behaviors of the components of a PV module are well known to generally result in internal stresses because the coefficient of thermal expansion of the EVA is much larger than that of Si (the coefficients of thermal expansion of EVA and Si were 2.70 × 10 −4 and 2.49 × 10 −6 , respectively) . Therefore, these large stresses caused by the EVA deformation may result in cracked solar cells and might have caused the formation of the diagonal cracks that preferentially occurred on the crystallographic planes, where the material toughness was lower . In this regard, Kang et al reported that the cracks caused by stress in a c‐Si wafer can relatively easily initiate and propagate along the <100> direction because this direction corresponds to that of the lowest plane strain tensile modulus.…”
Section: Resultsmentioning
confidence: 99%
“…Moreover, the different thermal expansion behaviors of the components of a PV module are well known to generally result in internal stresses because the coefficient of thermal expansion of the EVA is much larger than that of Si (the coefficients of thermal expansion of EVA and Si were 2.70 × 10 −4 and 2.49 × 10 −6 , respectively) . Therefore, these large stresses caused by the EVA deformation may result in cracked solar cells and might have caused the formation of the diagonal cracks that preferentially occurred on the crystallographic planes, where the material toughness was lower . In this regard, Kang et al reported that the cracks caused by stress in a c‐Si wafer can relatively easily initiate and propagate along the <100> direction because this direction corresponds to that of the lowest plane strain tensile modulus.…”
Section: Resultsmentioning
confidence: 99%
“…As a brittle material, silicon solar cells fail under the tensile stress; therefore, compressive stress is not crucial for solar cells. However, independently of the direction, high stresses can lead to delamination [23] and interconnector fatigue [24]. When exposed to ML, the dominating stress in the solar cells is tensile.…”
Section: Methodsmentioning
confidence: 99%
“…8,9 The In the first TMA heating run, all three types of encapsulants showed thermal expansion in both directions (machine direction MD and cross direction CD) indicating biaxial orientation, which is common in solar applications since it leads to better mechanical, optical and barrier properties. 52 However, for all test modules, yellowing was observed after DH test and the strongest for the material stacks using TPO as encapsulant (see Figure 7). Yellowing results from the presence of chromophoric groups in the polymer, which can be formed upon degradation of the polymer, the additives or unwanted reaction products thereof.…”
Section: Introductionmentioning
confidence: 91%