Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink

Numerical Simulation of Manifold Microchannel Heat Sinks for Thermal Management in a Li‐Ion Battery

“…Energy conservation equation: div r fñ h ð Þ¼div l f gradT f ð Þþq t (15) whereñ is the fluid velocity vector, u, v, and w are the components of the velocity in the direction of x, y, and z, respectively, r f is the fluid density, t is the time, m f is the dynamic viscosity of the fluid, p is the static pressure on the microelement, F x , F y , and F z are the components of mass force in the x, y, and z coordinate, respectively; h is the enthalpy, l f is the thermal conductivity of the fluid, T f is the fluid temperature, and q t is the volume heat generation rate of the battery. Fig.…”

“…In conclusion, the local heat transfer and friction performance of the IMCHS with ribs show a significant increase from the windward side of the ribs. Lin et al [15] investigated a system combining thermoelectric cooler and microchannel heat sink (MHS) for the thermal management of high-power light-emitting diodes, and nanofluid and water were used as the coolant. The heat transfer capacity of the MHS was increased by 38.6 %.…”

Using Graphene-powder-based Thermal Interface Material for High Lumen LED Array Chip: An Experimental Study of Heat Dissipation

“…(6,7) Since the heat transfer is still limited, some special high-thermal-conductivity materials or high cooling methods (8)(9)(10)(11)(12) should be used to enhance the efficiency. Therefore, some technologies, such as heat pipes, vapor chambers, refrigeration, air conditioning, sprays, phase materials, thermal pads, thermoelectric coolers, and microchannels, (13)(14)(15)(16)(17)(18)(19)(20)(21)(22)(23)(24) for assisting the cooling element to achieve heat dissipation and a special new technology to increase performance have been developed. Lee et al (25) proposed that graphene nanosheets of uniform shape may be incorporated into the silicon sealant for LEDs by solvent exchange.…”

Thermal conductivity, rheology and stability analysis of 2D tungsten disulphide‐doped polyaniline‐based nanofluids: An experimental investigation

“…As the NFs have demonstrated marvels in HT applications, therefore, these are becoming intriguing candidates for FTSs. For instance TiO 2 /water‐based NFs have improved the thermal performance of microchannel heat sink by 38.6% when integrated in thermal management system of high power light emitting diodes 3 . Although, NFs have improved the thermal conductivity with NPs loadings, but the degradation in the flow properties is the plausible for the increase the pressure drop and pumping power (PP) requirements 4 .…”

“…For instance TiO 2 /water-based NFs have improved the thermal performance of microchannel heat sink by 38.6% when integrated in thermal management system of high power light emitting diodes. 3 Although, NFs have improved the thermal conductivity with NPs loadings, but the degradation in the flow properties is the plausible for the increase the pressure drop and pumping power (PP) requirements. 4 This phenomenon happens due to viscous drag effects arising from stable colloidal dispersions 5 .…”