Thermal management of photonic integrated circuits: impact of holder material and epoxies

Kyatam, Shusmitha; Mukherjee, Debarati; Neto, Hugo; Mendes, Joana Catarina

doi:10.1364/ao.58.006126

Cited by 6 publications

(1 citation statement)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…With the advent of heterogeneous and hybrid integration in optoelectronic packages, component density on PICs is increasing to accommodate complex functionalities. The increasing number of temperature-sensitive photonic components, such as ring resonators, SOAs, III–V lasers, and arrayed waveguide gratings (AWGs), which are employed to access those functionalities, make the thermal management of PICs an essential part of the packaging design. , Many of these have a very narrow temperature operation window (15–35 °C), requiring precise control. Moreover, as the power demand driven by applications such as artificial intelligence (AI), high-performance computing (HPC), datacenters, and telecom is constantly increasing, lowering the power consumption and effective heat removal from the optoelectronic package are the two central challenges for the robust and reliable operation of PICs.…”

Section: Thermal Considerations For Next Generation Photonic Packagingmentioning

confidence: 99%

Integrated Photonics Packaging: Challenges and Opportunities

et al. 2022

View full text Add to dashboard Cite

Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the "packaging bottleneck".

show abstract

Section: Thermal Considerations For Next Generation Photonic Packagingmentioning

confidence: 99%