Thermal modeling and comparative analysis of jet impingement liquid cooling for high power electronics

Wu, Ruikang; Hong, Tang Sai; Cheng, Qingyu; Zou, Hao; Fan, Yiwen; Luo, Xiaobing

doi:10.1016/j.ijheatmasstransfer.2019.03.112

Cited by 71 publications

(8 citation statements)

References 36 publications

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“…2003), jet impingement cooling for high power electronics (Wu et al. 2019) and turbine blade cooling (Zhou, Wang & Li 2019). It is noted that both hydrodynamic and acoustic fields of the under-expanded supersonic free and impinging jets are sensitive to inlet conditions (e.g.…”

Section: Configuration and Numerical Methodsmentioning

confidence: 99%

“…The two nozzle-to-wall distances of 2d and 5d are selected in this study to examine the influence of impingement plate location on the characteristics of acoustic and hydrodynamic waves. The infinite-lipped nozzle is considered to be relevant to many industrial applications including short take-off and vertical landing aircraft (Krothapalli et al 1999;Alvi et al 2003), jet impingement cooling for high power electronics (Wu et al 2019) and turbine blade cooling (Zhou, Wang & Li 2019). It is noted that both hydrodynamic and acoustic fields of the under-expanded supersonic free and impinging jets are sensitive to inlet conditions (e.g.…”

Section: Configurationsmentioning

confidence: 99%

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Characteristics of acoustic and hydrodynamic waves in under-expanded supersonic impinging jets

et al. 2020

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Section: Configuration and Numerical Methodsmentioning

confidence: 99%

Section: Configurationsmentioning

confidence: 99%

Characteristics of acoustic and hydrodynamic waves in under-expanded supersonic impinging jets

et al. 2020

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“…Jet impingement cooling systems have been explored in microelectronics due to its high flow rate with lower pumping power and high local heat transfer rate. Wu et al [11] developed a jet impingement cooling structure for power electronics application, which provided sufficient cooling to the top and side surfaces of the chip. The experimental results showed the total thermal resistance could be as low as 0.041 K/W at a low flow rate of 1800 mL/min.…”

Section: Cooling Solutionsmentioning

confidence: 99%

Thermal Analyses of Power Electronics Integrated with Vapour Chamber Cooling

Chen

Yan

2020

Automot. Innov.

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Insulated gate bipolar transistor (IGBT) power module is used for power switching transistor devices in the power supply and motor control circuits in both hybrid electric vehicles and electric vehicles. The target of heat flux of IGBT is continuously increasing due to the demand for power rating improvements and miniaturisation. Without suitable efficient cooling technologies, excessively high temperature and uneven temperature distribution can cause high thermal stress, eventually leading to severe module failures. Therefore, highly efficient cooling solutions are highly required. Vapour chamber with phase change can provide quick heat transfer and low temperature gradient. This study proposes a new IGBT structure integrated with vapour chamber. The tests and simulation results indicate that the thermal and thermo-mechanical performances of IGBT integrated with vapour chamber are better than those of the IGBT with copper baseplate module. The thermal resistance between the junction and heat sink is reduced from 0.25 to 0.14 °C/W, and the temperature uniformity is greatly improved due to the phase change in the vapour chamber. The simulation also investigates the thermal stress distribution, deformation and thermal fatigue lifespan of IGBT power electronics module. A reduction of 21.8% in thermal stress and an increase of 9% in lifespan of Sn–3.5Ag solder are achieved.

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“…Besides, those applications have the typical issue associated with obviously undesired high cost, extra weight, and volume by introducing the cooling system. Moreover, due to the limited information about the actual operating environment and the actual load cycling, there is a lack of accurate thermal analysis and reliability assessment for each component [12]. Thus, failure of the cooling system can readily jeopardize and even destroy the whole electronic system.…”

Section: Introductionmentioning

confidence: 99%

Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review

Guo

Xun

et al. 2019

Micromachines

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The significant advance of power electronics in today’s market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the high junction temperature, low power losses, and excellent thermal stability, and thus are attractive to converters and MEMS devices applied in a high-temperature environment. This paper conducts an overview of high-temperature power electronics, with a focus on high-temperature converters and MEMS devices. The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology. Then, the research and development directions of SiC-based high-temperature converters in the fields of motor drives, rectifier units, DC–DC converters are discussed, as well as MEMS devices. Finally, the existing technical challenges facing high-temperature power electronics are identified, including gate drives, current measurement, parameters matching between each component, and packaging technology.

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Thermal modeling and comparative analysis of jet impingement liquid cooling for high power electronics

Cited by 71 publications

References 36 publications

Characteristics of acoustic and hydrodynamic waves in under-expanded supersonic impinging jets

Characteristics of acoustic and hydrodynamic waves in under-expanded supersonic impinging jets

Thermal Analyses of Power Electronics Integrated with Vapour Chamber Cooling

Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review

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