Thermal modeling and experimentation to determine maximum power capability of SCR's and thyristors

Walker, W.D.; Weldon, W.F.

doi:10.1109/63.750185

Cited by 14 publications

(6 citation statements)

References 14 publications

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“…The results vary depending on dimensions and manufacturing process of the silicon sample as well as on the measurement method. Comparing results of [6], [8] and [9], in general, one may expect that thin silicon layers have a different thermal conductivity than bulk crystalline silicon. Whether the thermal material model of bulk silicon is valid for power semiconductors with a die thickness of about 200 µm is investigated in this paper.…”

Section: Modeling Of Silicon Thermal Propertiesmentioning

confidence: 99%

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Transient non-linear thermal FEM simulation of smart power switches and verification by measurements

Kosel¹,

Sleik²,

Glavanovics³

2007

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

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Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly temperature dependent. In this paper, validity of a common non-linear silicon material model is verified by transient non-linear thermal FEM simulations of Smart Power Switches and measurements. For verification, over-temperature protection behavior of Smart Power Switches is employed. This protection turns off the switch at a predefined temperature which is used as a temperature reference in the investigation. Power dissipation generated during a thermal overload event of two Smart Power devices is measured and used as an input stimulus to transient thermal FEM simulations. The duration time of the event together with the temperature reference is confronted with simulation results and thus the validity of the silicon model is proved. In addition, the impact of non-linear thermal properties of silicon on the thermal impedance of power semiconductors is shown.

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Section: Modeling Of Silicon Thermal Propertiesmentioning

confidence: 99%

“…The bulk silicon thermal material properties can be described piecewise by empirical functions based on measurements presented in [10] and having e.g. the following form [6]:…”

Section: Modeling Of Silicon Thermal Propertiesmentioning

confidence: 99%

Transient non-linear thermal FEM simulation of smart power switches and verification by measurements

Kosel¹,

Sleik²,

Glavanovics³

2007

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

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“…A current challenge for the ECD method includes a higher level of excitation current capability required by the thyristors (static exciter). However, cyclic overloading of thyristors is possible because they are typically over-rated [32]. To further improve the system security, temperature monitoring of thyristors, transformers, and supplying power cables would be an advantage when the machine is operated in extreme modes of over-excitation.…”

Section: Case 2 -Multiple Contingencymentioning

confidence: 99%

Enhanced Power Capability of Generator Units for Increased Operational Security Using NMPC

Øyvang

Nøland

Sharma

et al. 2020

IEEE Trans. Power Syst.

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The ever-increasing penetration of intermittent energy sources introduces new demanding operating regimes for the bulk power generation in the power grid. During a worstcase power system disturbance scenario, the generator needs to operate beyond its limits to maintain stable operation. Therefore, a new online low-order thermal model of a hydrogenerator has been recently proposed, where the periodic extension of the long-forgotten capability diagram of the machine was in-depth investigated. An increased performance can be obtained if the total thermal capacity of the generator is exploited by applying optimal control theory in the Automatic Voltage Regulator (AVR). This paper proposes a Non-linear Model Predictive Controller (NMPC) combined with an Unscented Kalman Filter (UKF) with a modeling framework geared for use in a supervisory control structure for the conventional control system. The method provides maximum utilization of the machine's thermal capacity by providing the controller with an Enhanced Capability Diagram (ECD). Case studies on a single-machine system and a 16-bus multi-machine system were investigated. The results show that a satisfying controller action during different long-term voltage instability scenarios is realized.

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“…Thermal material properties are taken from manufacturers' datasheets for every modeled part respectively. Thermal material properties of the silicon chip are modeled as temperature dependent according to the material models presented in [4], which we have validated for simulations of Smart Power Switches in [5]. …”

Section: B Sps Device and Its Fem Modelmentioning

confidence: 99%

Evaluation of an electrical method for detection of die attach imperfections in Smart Power Switches using transient thermal FEM simulations

Kosel

Glavanovics

Scheikl

2008

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems

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A method for detection of die attach imperfections in Smart Power Switches is evaluated using non-linear transient thermal FEM simulations and measurements. This method employs smart functions of SPS devices such as overcurrent and over-temperature protection. The protective thermal shut down function is triggered by the temperature of the integrated temperature sensor. The temperature rise depends on power dissipation in the device and on the thermal junction to ambient impedance which is inter alia related to the die attach imperfection. The evaluation is performed on a two channel Smart Power Switch. Results are focused on practical relevance and sensitivity of this method to the influence of die attach thickness and die attach voids.

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Thermal modeling and experimentation to determine maximum power capability of SCR's and thyristors

Cited by 14 publications

References 14 publications

Transient non-linear thermal FEM simulation of smart power switches and verification by measurements

Transient non-linear thermal FEM simulation of smart power switches and verification by measurements

Enhanced Power Capability of Generator Units for Increased Operational Security Using NMPC

Evaluation of an electrical method for detection of die attach imperfections in Smart Power Switches using transient thermal FEM simulations

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