2000
DOI: 10.1016/s0040-6090(99)01050-0
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Thermal modelling of RTP and RTCVD processes

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Cited by 18 publications
(19 citation statements)
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“…Here, a lumped model as in Huang et al [7] and Kersch and Schafbauer [9] is used. (1) where i the index of the radial cell on the wafer with volume V i , mass density ρ, heat capacity c P , and temperature T i .…”
Section: Single Wafer Rapid Thermal Processing and Temperature Controlmentioning
confidence: 99%
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“…Here, a lumped model as in Huang et al [7] and Kersch and Schafbauer [9] is used. (1) where i the index of the radial cell on the wafer with volume V i , mass density ρ, heat capacity c P , and temperature T i .…”
Section: Single Wafer Rapid Thermal Processing and Temperature Controlmentioning
confidence: 99%
“…These radiative exchange factors depend on the geometry of the RTP chamber and the optical properties of the wafer surface. They need complicated computations such as Monte Carlo simulations [9]. Schaper et al [8] showed that the off-diagonal terms in Γ ij are small and can be ignored for the purpose of control system…”
Section: Single Wafer Rapid Thermal Processing and Temperature Controlmentioning
confidence: 99%
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“…Kersch and Schafbauer modelled a rapid thermal system in which measured values for the lamp power are entered in the studied RTP system model [9].…”
Section: Introductionmentioning
confidence: 99%