2009
DOI: 10.1016/j.radmeas.2009.10.082
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Thermal neutron dosimetry using MOSFET dosemeters

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Cited by 6 publications
(4 citation statements)
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“…Its value was found to be 1.58 mV/mSv (8.13 mV/mGy), much higher than their response to intermediate-fast neutrons which is 0.017 mV/mSv (0.22 mV/mGy). These values show that the response of the MOSFETs was improved compared to the response obtained in previous studies in which LiF powder was deposited on the gate surface [13]. This response is also higher 5 than previously reported in the literature with different neutron converters such as Gd in which the sensitivity to thermal neutrons was found to be 1.5-.1.6 mV/mGy [7].…”
Section: Resultsmentioning
confidence: 42%
“…Its value was found to be 1.58 mV/mSv (8.13 mV/mGy), much higher than their response to intermediate-fast neutrons which is 0.017 mV/mSv (0.22 mV/mGy). These values show that the response of the MOSFETs was improved compared to the response obtained in previous studies in which LiF powder was deposited on the gate surface [13]. This response is also higher 5 than previously reported in the literature with different neutron converters such as Gd in which the sensitivity to thermal neutrons was found to be 1.5-.1.6 mV/mGy [7].…”
Section: Resultsmentioning
confidence: 42%
“…The trapped charges affect the gate voltage by reordering of charges. The measurement of the shift of the threshold voltage is proportional to the absorbed dose [1,5,6,8]. The threshold voltage shift, ΔV T , which is the measured quantity, depends upon: a) the incident particle type and energy (dE/dx) b) the ionizing particle penetration into the oxide c) the absorbed dose, D, d) the gate bias during irradiation and e) the gate insulator thickness.…”
Section: Resultsmentioning
confidence: 99%
“…For this exposure mode, usually called zero bias mode, the expected response of the voltage shift ΔVT can be expressed in the form [1,6,8]:…”
Section: Resultsmentioning
confidence: 99%
“…Step 1: Fabrication of RF MOSFET Device Similar size MOS capacitors were fabricated on a 4 inch diameter and 800 μm thick n-type silicon wafer and the grown layers were characterized by C-V, C-F and sheet resistance measurements [20][21][22]. To fabricate metal-oxide-semiconductor, the silicon wafers were cleaned by following the standard cleaning procedure to remove insoluble organics and metallic contaminants.…”
Section: Process For Measurements Of Device Parametersmentioning
confidence: 99%