Thermal performance and reliability characterization of bonded interface materials (BIMs)

DeVoto, Douglas; Paret, Paul; Mihalic, Mark; Narumanchi, Sreekant; Bar‐Cohen, Avram; Matin, Kaiser

doi:10.1109/itherm.2014.6892310

Cited by 11 publications

(5 citation statements)

References 12 publications

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“…Because BIMs are promising [9][10][11][12], work at the National Renewable Energy Laboratory (NREL) has focused on assessing their thermal performance and reliability on a largearea attachment. Conclusions on thermal performance and reliability from the present effort are intended to directly assist incorporation of these materials into automotive power electronics designs.…”

Section: Reliability Of Emerging Bonded Interfacementioning

confidence: 99%

Reliability of Emerging Bonded Interface Materials for Large-Area Attachments

Paret

DeVoto

Narumanchi

2016

IEEE Trans. Compon., Packag. Manufact. Technol.

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Section: Reliability Of Emerging Bonded Interfacementioning

confidence: 99%

Reliability of Emerging Bonded Interface Materials for Large-Area Attachments

Paret

DeVoto

Narumanchi

2016

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Accelerated aging was carried out by exposing the disks assembly with alloys at the interface at an elevated temperature of 130°C (followed reliability conditions of [30]) in an atmospheric furnace for extended periods of time. Fig.…”

Section: Accelerated Thermal Agingmentioning

confidence: 99%

“…The Cu disk assembly with alloys at the interface was placed in a thermal cycling chamber to cycle from −40°C to 80°C [30]. The heating and cooling were performed at ramp rates of 3°C/min for both the heating and cooling transitions.…”

Section: Thermal Cyclingmentioning

confidence: 99%

Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials

Roy

Bhavnani

Hamilton

et al. 2015

Microelectronics Reliability

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“…Advanced power semiconductor packaging targets to optimize thermal management while obtaining high temperature applications (De La Cruz et al, 2016;Ji et al, 2016;Calata et al, 2005;DeVoto et al, 2014;Wang et al, 2019;Wang et al, 2018). One fateful challenge is the large-area substrate bond.…”

Section: Introductionmentioning

confidence: 99%

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Tan

Chen

et al. 2019

SSMT

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Purpose This paper aims to use nano-silver paste to design a new bonding method for super-large-area direct-bonded-aluminum (DBA) plates. It compared several frequently used bonding methods and proved the feasibility of an optimized low-pressure-assisted double-layer-printed silver sintering technology for large-area bonding to increase the thermal conductivity of power electronic modules with high junction temperature, higher power density and higher reliability. Design/methodology/approach The bonding profile was optimized by using transparent glasses as substrates. Thus, the bonding qualities could be directly characterized by optical observation. After sintering, the bonded DBA samples were characterized by nondestructive X-ray computed tomography system, scanning electron microscopy equipped with an energy dispersive spectrometer. Finally, bonding stress evolution was characterized by shear tests. Findings Low-pressure-assisted large-area double-layer-printed bonding process consisting of six-step was successfully developed to bond DBA substrates with the size of 50.8 × 25.4 mm. The thickness of the sintered-silver bond-line was between 33 and 74 µm with the average porosity of 12.5 per cent. The distribution of shear strength along the length of DBA/DBA bonded sample was from 9.7 to 18.8 MPa, with average shear strength of 15.5 MPa. The typical fracture primarily propagated in the sintered-silver layer and partially along the Ni layer. Research limitations/implications The bonding stress needs to be further improved. Meanwhile, the thermal and electrical properties are encouraged to test further. Practical implications If nano-silver paste can be used as thermal interfacial material for super-large-area bonding, the thermal performance will be improved. Social implications The paper accelerated the use of nano-silver paste for super-large-area DBA bonding. Originality/value The proposed bonding method greatly decreased the bonding pressure.

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Thermal performance and reliability characterization of bonded interface materials (BIMs)

Cited by 11 publications

References 12 publications

Reliability of Emerging Bonded Interface Materials for Large-Area Attachments

Reliability of Emerging Bonded Interface Materials for Large-Area Attachments

Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

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