Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials

Nylander, Andreas; Darmawan, Christian Chandra; Boyon, Ana Borta; Divay, Laurent; Samani, Majid Kabiri; Ras, Mohamad Abo; Fortel, Julien; Fu, Ying; Ye, Lilei; Ziaei, A.; Liu, Johan

doi:10.1109/therminic.2018.8593282

Cited by 5 publications

(6 citation statements)

References 19 publications

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“…The coating technique that cover on top of VACNT before complete the TIMs assembly has gained attention from other researchers when dealing with VACNT and found that the coating will help on reducing thermal contact resistance, increasing surface contact between VACNT and heat sink, and maintaining the optimum thermal conductivity . In addition, the reliability of the thermal performance of TIMs is an important factor to be considered.…”

Section: Carbon Allotrope Materials In Tims Applicationmentioning

confidence: 99%

“…81 The coating technique that cover on top of VACNT before complete the TIMs assembly has gained attention from other researchers when dealing with VACNT and found that the coating will help on reducing thermal contact resistance, increasing surface contact between VACNT and heat sink, and maintaining the optimum thermal conductivity. 80,[88][89][90] In addition, the reliability of the thermal performance of TIMs is an F I G U R E 6 SEM image of VACNT using PE-CVD 4,83 SEM, scanning electron microscopy; PE-CVD, plasmaenhanced chemical vapor deposition; VACNT, vertically aligned carbon nanotube important factor to be considered. Nylander et al 89 observed the thermal resistance within 100 cycles, where thermal performance was degraded.…”

Section: Carbon Nanotubesmentioning

confidence: 99%

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Allotrope carbon materials in thermal interface materials and fuel cell applications: A review

2019

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Summary The performance of allotrope carbon materials has been explored because of their superior properties in energy system applications. This review provides an understanding of the current work focusing on the applications of selected carbon materials in important energy systems, focus on thermal interface materials (TIMs), and fuel cell applications. This article begins with the introduction of TIMs and fuel cell in general working principle and presents details on carbon materials. The discussion focuses on updates from the latest research work and addresses current challenges and opportunities for research toward TIMs and fuel cell applications. The optimum performance of TIMs was seen when thermal conductivity achieved at a maximum of 3000 W (m K)−1 by using vertically aligned carbon nanotubes (CNTs) and a minimum internal thermal resistance of 0.3 mm2 K W−1. Meanwhile for fuel cell, the platinum/CNTs catalyst applied proton exchange membrane fuel cell achieved high power density of 661 mW cm−2 in the presence of Nafion electrolyte membrane. This review provides insights for scientists about the use of carbon materials, especially in energy system applications.

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Section: Carbon Allotrope Materials In Tims Applicationmentioning

confidence: 99%

Section: Carbon Nanotubesmentioning

confidence: 99%

Allotrope carbon materials in thermal interface materials and fuel cell applications: A review

2019

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“…Once these components are in use and generating thermal load, the heat may be transferred from the CPU die to the first layer of thermal interface material (TIM1). This TIM1 is applied in between the CPU die and IHS and may come in the form of thermally conductive paste or thermally conductive phase change material (e.g., a thermal pad) (Nylander et al, 2018;Shia & Yang, 2020). This layer can help to fill the air gaps at a microscopic level in order to maximize the thermal transfer area from the die to the IHS.…”

Section: Die-heatsink and Die-cold Plate Transfer Processmentioning

confidence: 99%

Reviewing Cooling Strategies for Post-Dennard Era Computing and Modern Electrothermal Phenomena

Sapasap,

Rojas

2023

J Stud Res

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Excessive thermal runaway typically manifests itself in computer component damage and other various negative side effects. As a mitigation strategy, end-users and consumers typically implement differing methods of component cooling, including fan-heatsink cooling, heatsink-only cooling, and liquid-based cooling. Different cooling methods remain impactful to modern computing, as it remains a core component in the thinking of thermal design and reliability engineering in the realm of semiconductor devices. The industry-wide acceptance of the end of Dennard scaling and the imminent end of Moore’s law are major factors that are currently impacting CPU power consumption trends and modern cooling philosophies. Transistor packing and process refinement is beginning to push against atomic boundaries in combination with phenomena such as leakage current and high current density, causing a general trend of increasing temperatures generation-to-generation in microprocessors. As a result, thermal mitigation strategies and protections must be in place to reduce damage and catastrophic failure while increasing performance of the die package. In a high-heat scenario, liquid-cooling can provide up to 38% to 48% improvement over fan-heatsink variants depending on the type of workload executed by the processor. Fan-heatsink cooling faces thermal resistance limitations in the form of spreading and air convection resistance as a result of heatsink material composition, the resistance along the path of heat flow impeding conduction rate, and the lower thermal conductivity of air compared to liquid. Currently, the best performing variant appears to be liquid-based cooling while fan-heatsink combinations provide adequate levels of thermal dissipation based on these observations.

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“…In this study, we subjected fabricated CNT array TIMs to thermal cycling and subsequently measured the thermal performance to investigate the degradation of the TIM. This paper is an extended and revised version of a conference report that was presented at Therminic 2018 [15] and follows the work of Ni et al [16] and Daon et al [17] on the HLK5 polymer used to bond CNT arrays for TIM applications. This is the first reported study on the thermal reliability of a CNT array TIM.…”

Section: Introductionmentioning

confidence: 99%

“…Simple schematic of the origin of the different thermal resistance contributions in the CNT array TIM. The black contributions were included in the thermal interface resistance results that were obtained from the laser flash experiment[15].…”

mentioning

confidence: 99%

Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material

et al. 2019

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As feature density increases within microelectronics, so does the dissipated power density, which puts an increased demand on thermal management. Thermal interface materials (TIMs) are used at the interface between contacting surfaces to reduce the thermal resistance, and is a critical component within many electronics systems. Arrays of carbon nanotubes (CNTs) have gained significant interest for application as TIMs, due to the high thermal conductivity, no internal thermal contact resistances and an excellent conformability. While studies show excellent thermal performance, there has to date been no investigation into the reliability of CNT array TIMs. In this study, CNT array TIMs bonded with polymer to close a Si-Cu interface were subjected to thermal cycling. Thermal interface resistance measurements showed a large degradation of the thermal performance of the interface within the first 100 cycles. More detailed thermal investigation of the interface components showed that the connection between CNTs and catalyst substrate degrades during thermal cycling even in the absence of thermal expansion mismatch, and the nature of this degradation was further analyzed using X-ray photoelectron spectroscopy. This study indicates that the reliability will be an important consideration for further development and commercialization of CNT array TIMs.

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Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials

Cited by 5 publications

References 19 publications

Allotrope carbon materials in thermal interface materials and fuel cell applications: A review

Allotrope carbon materials in thermal interface materials and fuel cell applications: A review

Reviewing Cooling Strategies for Post-Dennard Era Computing and Modern Electrothermal Phenomena

Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material

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